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Circuit Components
Circuit Components

Semiconductor Materials
Semiconductor Materials

Component Identification
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Goal - WebPhysics
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Powerpoint
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Final Presentation - ECE Senior Design
Final Presentation - ECE Senior Design

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... The current size of our boards is 170mm x 85mm and 100mm x 75mm which comes out to 34 in2 of area, slightly larger than half of the maximum 60. The size of these boards leaves more than enough room for component placement and signal routing as shown in Appendix B. The only limitations with large par ...
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Surface-mount technology



Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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