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The IG-102 Goes Transistor!
The IG-102 Goes Transistor!

... Fig. 4. TR4-TR10 - Radio Shack #2 76-2039 or equivalent; TRI I - auat-oate MOSFET; cn - Area 309 padder; CT2 - Area 306 padder; CT4 - Area 465 trimmer; L1 and L2 - d e; L3 20 turns #30 enamel wire on 2 W, lOOk resistor. t ernall y as a subun it. ...
Stream Depth Sensor and PCB Mill tutorial
Stream Depth Sensor and PCB Mill tutorial

... Abstract— An increased concern in the environment’s health in different ecosystems has sparked a need for instruments that can measure different aspects of each system. This stream depth sensor developed by the National Oceanic and Atmospheric Association (NOAA) uses an acoustic sensor to measure th ...
4.5V to 17V Input, 12A Synchronous Step-Down
4.5V to 17V Input, 12A Synchronous Step-Down

... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
EMG Biofeedback Device - University of Wisconsin–Madison
EMG Biofeedback Device - University of Wisconsin–Madison

... stimulus triggered by their EMG signal. Through operant conditioning, the child will learn that he can use this device to create a pleasurable sensation for himself. We hope this will provide independence to the child. The design utilizes three surface electrodes to detect EMG signals from the child ...
PS-6.9 - Series and Parallel Circuits Worksheet
PS-6.9 - Series and Parallel Circuits Worksheet

... SERIES AND PARALLEL CIRCUITS ELECTRIC CIRCUITS  An electric circuit provides a complete, closed path for an electric current. ...
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Parallel Circuits Test

... b. Violate Kirchhoff’s voltage law if they have different output voltages  c. Cancel each other, producing a net voltage of zero.  d. Are more economical than a single large voltage source.  ...
Mir4
Mir4

... should be between 3 and 5 Volts. It is safe to have an A-meter connected. In case of excessive current (> 100 mA), switch off immediately and check. The processor should survive a 1-2 second inversion of polarity. A high current may also be due to a transistor with a bad input connection. Both trans ...
Index: SHARP Electronic Components
Index: SHARP Electronic Components

Index: SHARP Electronic Components
Index: SHARP Electronic Components

... In setting R1 and C1, use suitable values after considering under the real condition The circuit constant is a example. It is difference from mounting equipment. Please select it by your mounting equipment. This device has a transistor as protection element between VCC and GND to improve anti-static ...
Faculty Websites
Faculty Websites

... Active Vs Passive Components • There are two types of components: passive components and active components. • Passive Components : A passive device is one that contributes no power gain (amplification) to a circuit or system. It has no control action and does not require any input other than a sign ...
PEM NOS 74: Determine the Feasibility of Repair of
PEM NOS 74: Determine the Feasibility of Repair of

... • Safety/protection devices • Components of electrical panels 3. The type of repair to be made requires one or more techniques to be applied depending upon its complexity. The techniques are standard within the sector but may require some modification to achieve the required result. The techniques m ...
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Lecture 2: Resistors and Capacitors Capacitance:

... a useful fact when trying to guess the transient (short term) behavior of a circuit the voltage across a resistor can change instantaneously ...
Lecture 2: Resistors and Capacitors Capacitance:
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... We can write an equation that looks like Ohm's law by defining V*: V* = V0 sin(ωt + π /2) ...
WHM1722AE
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... The recommended motherboard layout is shown in diagram of Foot Print/Mounting Layout. Sufficient numbers of ground vias on center ground pad are essential for the RF grounding. The width of the 50-Ohm microstrip lines at the input and output RF ports may be different for different property of the su ...
Stat 330 (Spring 2015): Homework 4
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Ohm Zone: Series Circuit I
Ohm Zone: Series Circuit I

... Below is the menu from OhmZone. Click on the “popups” button that is the question mark. This will give you a description of each of the components as your mouse moves over them. You will find this very useful. ...
Electrical Energy II
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Power line chokes - Current-compensated frame core
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... varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. Washing processes may damage the product due to the ...
PCR8P75M - Micross Components
PCR8P75M - Micross Components

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Solution - Qi Xuan

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Class Assessment Sheet

iC-OV BLCC OVC3 - iC-Haus
iC-OV BLCC OVC3 - iC-Haus

... After opening the dry pack, devices must be mounted within 8 hours (in factory conditions of maximum 30 °C / 60% RH) or must be stored at <20% RH. Devices require baking before mounting if the Humidity Indicator Card shows >20% when read at 23°C ±5°C or if the conditions mentioned above are not met. ...
DIY Kit189. 120 Second Voice Recorder Module
DIY Kit189. 120 Second Voice Recorder Module

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Version 2

... Check that no IC pins are bent up under the body of the IC. This can sometimes happen when inserting ICs into ...
TDA7052A/AT
TDA7052A/AT

... Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operatio ...
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Surface-mount technology



Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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