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Six Channel SiC MOSFET Driver Features
Six Channel SiC MOSFET Driver Features

... Mechanical Instructions Designed to directly mount to Cree 45 mm style power modules, the 6-ch gate driver also has several other mounting holes to secure the assembly. Attach the gate driver board to the power module via the 4x Module screw holes (see diagram below) using the recommended hardware ...
Electronics Glossary
Electronics Glossary

Electronic glossary
Electronic glossary

... current is passed. Surrounding the rotor are two magnets, one with the north pole facing the rotor and the other with the south pole facing the rotor. The repulsion between the poles of the electromagnet and the surrounding magnet makes the rotor spin by half a turn. At this point, the electromagnet ...
click here
click here

... Latest update 29Nov2015. w7zoi
 ...
General Safety Instructions
General Safety Instructions

... from time to time, as well as state-ofthe-art practices and procedures must be observed for the intended scope of application of the product. Where applicable, take all appropriate measures to ensure the requirements are met. Valve conform to European directives 2006/95/CE for low voltage, 2004/108/ ...
DC Analysis
DC Analysis

... • DC steady-state (the circuit has been in the same state for a long time), capacitors act like open circuits and inductors act like shorts. The below figures show the process of replacing these circuit devices with their DC equivalents. In this case, all that remains is a voltage source and a lone ...
HC2LP
HC2LP

... ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. ...
Series Circuits Worksheets 1. In this circuit, three resistors receive
Series Circuits Worksheets 1. In this circuit, three resistors receive

PicProg R5 - EZ Kits
PicProg R5 - EZ Kits

... First mount the small parts such as diodes and resistors. Next, mount the bigger components in order of their height. The diodes are in a small glass DO34 package, and at times the printing on these can be hard to read. It is important that you do not mix up the three types. If needed use a magnifyi ...
IPC-7801 Reflow Oven Process Control Standard Working Draft 2
IPC-7801 Reflow Oven Process Control Standard Working Draft 2

... the surface easily, and like polyimide, can be easily placed or moved to various locations. Metal tape is a good choice for attachment when the surface of the assembly must not be damaged. The residue left by the tape can easily be removed from the assembly. Double-sided metal tapes are stronger the ...
History of Semiconductor
History of Semiconductor

... a layer of protective oxide on the junctions. This process allowed metal interconnections to be evaporated onto the flat transistor surface and replaced the hand wiring. The new process used silicon instead of germanium, and made commercial production of ICs possible. The initial resistance to the n ...
obsolete product
obsolete product

... The surface mount versions of the HL01RZC series are designed for SMT reflow soldering. During this standard process devices should be heated at a rate not to exceed 3 degrees C per second. The peak reflow temperature is 260 degrees C. The device should not be exposed to the peak temperature ±10 deg ...
Users Guide for the Non
Users Guide for the Non

... The VA ratings on transformers is also a consideration. Within reason, a larger transformer has more constant regulation under load, but this chip operates very successfully without extremely large transformers. Many have successfully used 160VA transformers, while the 220VA range seems to be adequa ...
Industrial / Power
Industrial / Power

FB00AKAR 650 nm Analogue OptoLock® Fiber Optic
FB00AKAR 650 nm Analogue OptoLock® Fiber Optic

... Cleaning,  degreasing  and  post  solder  washing  should  be  carried  out  using  standard  solutions  compatible  with  both  plastics  and  the  environment.  For  example,  recommended  solutions  for  degreasing  are  alcohols  (methyl,  isopropyl  and  isobutyl).  Acetone,  ethyl  acetate,  p ...
ITIC Curve ANSI Range B - University of South Florida
ITIC Curve ANSI Range B - University of South Florida

Chapter 6
Chapter 6

... 6.3 Inductors (5) Example 6 Determine vc, iL, and the energy stored in the capacitor and inductor in the circuit of circuit shown below under dc conditions. Answer: iL = 3A vC = 3V wL = 1.125J wC = 9J ...
output will oscillate between values of approximately +10 volts and
output will oscillate between values of approximately +10 volts and

FM radio circuit
FM radio circuit

BE LAB
BE LAB

... There are 2 types of transistor NPN and PNP. Emitter is the terminal which emitts charge carriers,heavily doped region collector is the terminal which collects the charge carries and moderately doped region or terminal. Base is the region through which charge carriers passes and thinly doped region. ...
971HA - Edsyn
971HA - Edsyn

... Adjust air output to 2-4 scfh. Set temperature to 700°F. Using a WS630 SMD Pull Wire, thread the pullwire under the leads of one side of the SMD and again thread the wire under the leads of the opposite side. 5. Anchor one end of the Pull Wire to an unused hole of the circuit board or maybe tape it ...
PowerPoint
PowerPoint

AlexanderCh06finalR1
AlexanderCh06finalR1

... Determine vc, iL, and the energy stored in the capacitor and inductor in the circuit of circuit shown below under dc conditions. Answer: iL = 3A vC = 3V wL = 1.125J wC = 9J ...
User Manual Rev. 01
User Manual Rev. 01

... 0V Line Alignment Sometimes you may find the 0V line (the trace corresponding to 0V input voltage) does not match with the VPOS indicator at the screen left border. This can easily be fixed by performing the “0V line alignment” function. First, set the couple switch [CPL] to GND position. Then press ...
Abstract - PG Embedded systems
Abstract - PG Embedded systems

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Surface-mount technology



Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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