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Introduction

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Using the “Clicker”

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Using the “Clicker” - Boston University: Physics

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... combustion of fossil fuels, particularly in areas where low temperature applications are involved. Solar energy has an enormous potential for the heating and cooling of buildings, producing hot water for domestic and industrial purposes, cooking, warming greenhouses for agricultural crops, etc. Howe ...
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... for heat is the British thermal unit (Btu). The Btu is defined in terms of the basic SI metric units: 1 Btu = 778.17 ft lbf This unit is termed the International British thermal unit. For much engineering work, the accuracy of other data does not warrant more accuracy than the relation 1 Btu = 778 f ...
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... regime and heating apartments. But the operation of air conditioners in this regime is physically possible and economically effective only up to temperatures of free air higher then minus 15 °C. At lower temperatures airconditioning off and actually required backup heating system. The technical solu ...
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< 1 ... 25 26 27 28 29 30 31 32 33 ... 54 >

Heat sink



A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device into a coolant fluid in motion. Then-transferred heat leaves the device with the fluid in motion, therefore allowing the regulation of the device temperature at physically feasible levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the basic device is insufficient to moderate its temperature.A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal grease improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device.
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