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Relation between local temperature gradients and the direction of
Relation between local temperature gradients and the direction of

new energy-efficient building concepts affecting human thermal
new energy-efficient building concepts affecting human thermal

... The transport of thermal energy by the blood flow in the micro-circular system, also called blood perfusion, is more important to heat transfer throughout the tissue than that in the macrocirculation. The blood-tissue interface area varies tremendously through the circulation system. For example, th ...
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... Similarities and differences Fluctuational fields are responsible for heat transfer and forces between two parallel plates. Key difference: 1. no heat flux contribution for isothermal systems. 2. Spectral range: Casimir : visible frequencies. Heat transfer : IR frequencies. ...
ENGR 7901 - Heat Transfer II 1 Introduction 2 The Flat Plate
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... and transversly are inline. Staggered tube arrays have every other row offset usually by one half of the tube to tube spacing. In such applications, the heat transfer coefficient and hence the Nusselt number degrades as a result of the complex flow arrangements and warming of the fluid. Since the cy ...
Investigation of Automobile Radiator Using Nanofluid
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... • However, for historical reasons HDD are often made available with base temperatures of 65°F (18°C), or 60°F (15.5°C) - base temperatures that are approximately appropriate for a good proportion of buildings. ...
What is Heat Stress? » Keep the “Fun” in Fun Runs. » How do you
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... » What is Heat Stress? Vigorous exercise in sport places some people at risk of heat illness. Even in cool weather, heat illness may occur in people exercising at high intensity for more than about 45 minutes. The risk of heat illness is obviously greater in hot and humid weather because: • during h ...
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... Entropy and the second law of thermodynamics A thermally isolated system will never see its entropy decrease, i.e., ΔS ≥ 0 for any process in a thermally isolated system. ...
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... produced. Presumably this increase in internal energy is the result of mechanical work done. The copper band is wrapped several times around the cylinder and held taut by a large mass suspended from one end. We can calculate the work as (force)x(distance), and to do this we must measure both the for ...
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... heaters, furnaces, refrigerators, and solar collectors are designed primarily on the basis of heat transfer analysis. The heat transfer problems encountered in practice can be considered in two groups: (1) rating and (2) sizing problems. The rating problems deal with the determination of the heat tr ...
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... heaters, furnaces, refrigerators, and solar collectors are designed primarily on the basis of heat transfer analysis. The heat transfer problems encountered in practice can be considered in two groups: (1) rating and (2) sizing problems. The rating problems deal with the determination of the heat tr ...
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... A heat engine A heat engine is a device that uses heat to do work. A gasoline-powered car engine is a good example. To be useful, the engine must go through cycles, with work being done every cycle. Two temperatures are required. The higher temperature causes the system to expand, doing work, and t ...
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Heat sink



A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device into a coolant fluid in motion. Then-transferred heat leaves the device with the fluid in motion, therefore allowing the regulation of the device temperature at physically feasible levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the basic device is insufficient to moderate its temperature.A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal grease improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device.
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