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ASE 112 Electrical Fundamentals
ASE 112 Electrical Fundamentals

... A1.1.6 Identify electrical units of measure such as volts, amperes, ohms, and watts. A1.1.7 Explain Ohm’s law formulas. A1.1.8 Calculate circuit values using Ohm’s law. A1.1.9 State the direction of electron movement between two charges, given their polarity. A1.1.10 Explain the function of resistan ...
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... The MAX5080 evaluation kit (EV kit) is a fully assembled and tested circuit board that evaluates the MAX5080 PWM/PFM step-down converter IC with an integrated high-side switch. The MAX5080 EV kit operates over a wide 4.5V to 40V input voltage range and provides up to 1A at the 3.3V output. The MAX50 ...
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... protocol. Each register contains a high byte (CPRx_H) and a low byte (CPRx_L). The CPRx_H registers are used to configure the Frame Wait Time. The CPRx_L registers are currently unused (Reserved for Future Use) and must remain set to $00. CPR0 is a read-only register containing the default ISO/IEC 1 ...
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... Introduction: Have you ever touched an incandescent light bulb that has been on for a while? Ouch! What you feel is frictional heat produced by the current moving through the light’s resistor. The high heat produced in electric circuits leads to the danger of electrical fires. A fuse is a safety dev ...
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... 84 dB SNR and Excellent Channel-to-Channel Matching CIRCUIT FUNCTION AND BENEFITS Cost sensitive, high channel count applications that require wide dynamic range can effectively use the AD7607 8-channel integrated data acquisition system (DAS) with on-chip 14-bit SAR ADCs to achieve greater than 80 ...
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Surface-mount technology



Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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