OLCircuits.com Matchbox Build Guide
... picking up stray radio frequency or other interference. This is especially true in effects that are high gain by nature. The second reason to keep your wire lengths short is that it makes it easier to end up with a professional looking build that doesn’t have a bunch of wires compressed between pots ...
... picking up stray radio frequency or other interference. This is especially true in effects that are high gain by nature. The second reason to keep your wire lengths short is that it makes it easier to end up with a professional looking build that doesn’t have a bunch of wires compressed between pots ...
M3PhonoBoardHardwiri..
... V1 – Note that I have not highlighted pin 7 yet but I should do that now! The only pins not connected now are pins 4 & 5 - these will be used for our filament wiring - in other words we will be using some wiring from the power supply board to connect to these pins to provide the filament current (th ...
... V1 – Note that I have not highlighted pin 7 yet but I should do that now! The only pins not connected now are pins 4 & 5 - these will be used for our filament wiring - in other words we will be using some wiring from the power supply board to connect to these pins to provide the filament current (th ...
Experiment 2: Resistors in Series and Parallel
... i) An outline of what you did in the lab (its aim, theory, method, equipment and results using data tables and graphs) ii) Theoretical calculations. Make sure your methods are clear by providing a single, typical example worked out with detailed steps for each method. Just give the end results of ot ...
... i) An outline of what you did in the lab (its aim, theory, method, equipment and results using data tables and graphs) ii) Theoretical calculations. Make sure your methods are clear by providing a single, typical example worked out with detailed steps for each method. Just give the end results of ot ...
MA4AGSBP907 AlGaAs Solder Bump ... Flip-Chip PIN Diode
... ESD techniques should be used when handling these devices. These devices are rated Class 0, (0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF±10%, R = 1.5kW±1%]. Even though tested die pass 50V ESD, they must be handled in a static-free environment. ...
... ESD techniques should be used when handling these devices. These devices are rated Class 0, (0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF±10%, R = 1.5kW±1%]. Even though tested die pass 50V ESD, they must be handled in a static-free environment. ...
PM-300 COLLINS 30L-1 REPLACEMENT POWER SUPPLY
... all parts are present. If you are missing any parts, please contact Harbach Electronics, LLC. ...
... all parts are present. If you are missing any parts, please contact Harbach Electronics, LLC. ...
Advanced Circuits
... Introduction: Have you ever touched an incandescent light bulb that has been on for a while? Ouch! What you feel is frictional heat produced by the current moving through the light’s resistor. The high heat produced in electric circuits leads to the danger of electrical fires. A fuse is a safety dev ...
... Introduction: Have you ever touched an incandescent light bulb that has been on for a while? Ouch! What you feel is frictional heat produced by the current moving through the light’s resistor. The high heat produced in electric circuits leads to the danger of electrical fires. A fuse is a safety dev ...
ADP-40 Analog Door Phone P/N 1200761L1
... After an electrical box is securely mounted and wires are connected, remove the paper liner from the faceplate gasket. Place the side of the gasket from which you removed the paper toward the back side of the faceplate, aligning the gasket with the CALL button hole. Push the 1-inch, 6-32 screws thro ...
... After an electrical box is securely mounted and wires are connected, remove the paper liner from the faceplate gasket. Place the side of the gasket from which you removed the paper toward the back side of the faceplate, aligning the gasket with the CALL button hole. Push the 1-inch, 6-32 screws thro ...
MAX9986AEVKIT.pdf
... be attached to the PCB ground plane with a low-thermal and electrical impedance contact. Ideally, this is achieved by soldering the backside of the package directly to a top metal ground plane on the PCB. Alternatively, the EP can be connected to an internal or bottom-side ground plane using an arra ...
... be attached to the PCB ground plane with a low-thermal and electrical impedance contact. Ideally, this is achieved by soldering the backside of the package directly to a top metal ground plane on the PCB. Alternatively, the EP can be connected to an internal or bottom-side ground plane using an arra ...
Circuit Note CN-0365
... 175°C plastic packages in this circuit. One of the major failure mechanisms in high temperature packaging is the bond wire-to-bond pad interface, particularly when gold (Au) and aluminum (Al) metals are mixed, as is typical in plastic packages. Elevated temperature accelerates the growth of AuAl int ...
... 175°C plastic packages in this circuit. One of the major failure mechanisms in high temperature packaging is the bond wire-to-bond pad interface, particularly when gold (Au) and aluminum (Al) metals are mixed, as is typical in plastic packages. Elevated temperature accelerates the growth of AuAl int ...
And how to build one
... suppression resistors, and so forth. No changes are made that change the sound, which is, after all, the reason we do this. ...
... suppression resistors, and so forth. No changes are made that change the sound, which is, after all, the reason we do this. ...
Schematics - Schematic devices and diagrams
... into a circuit “chip” called and integrated circuit. ...
... into a circuit “chip” called and integrated circuit. ...
GE Bushing Potential Device
... contains a cylindrical metal plate, thus forming a capacitance voltage divider. Provision is made to connect the bushing potential device to this metal plate through an outlet located in the bushing mounting flange, and it is connected to the line through the capacitance of the bushing. Being connec ...
... contains a cylindrical metal plate, thus forming a capacitance voltage divider. Provision is made to connect the bushing potential device to this metal plate through an outlet located in the bushing mounting flange, and it is connected to the line through the capacitance of the bushing. Being connec ...
resistors old
... Resistors (R), are the most commonly used of all electronic components, to the point where they are almost taken for granted. There are many different resistor types available with their principal job being to "resist" the flow of current through an electrical circuit, or to act as voltage droppers ...
... Resistors (R), are the most commonly used of all electronic components, to the point where they are almost taken for granted. There are many different resistor types available with their principal job being to "resist" the flow of current through an electrical circuit, or to act as voltage droppers ...
Evaluates: MAX17112 MAX17112 Evaluation Kit General Description Features
... with a 4.5V input. The step-up switching regulator output voltage can be adjusted from VIN to 20V by changing the values of the feedback resistors (see the Evaluating Other Output Voltages section). The MAX17112 EV kit can operate from a 2.6V to 5.5V input supply. When input voltage is less than 4.5 ...
... with a 4.5V input. The step-up switching regulator output voltage can be adjusted from VIN to 20V by changing the values of the feedback resistors (see the Evaluating Other Output Voltages section). The MAX17112 EV kit can operate from a 2.6V to 5.5V input supply. When input voltage is less than 4.5 ...
DC1924A - Linear Technology
... Demonstration circuit 1924A is a high performance buckboost converter featuring the LT®8705 that can operate from input voltages above, below or equal to the output voltage. The demo board input range is 36V to 80V. The output is optimized for 48V at 5A, with the output current limit set at 7A. (The ...
... Demonstration circuit 1924A is a high performance buckboost converter featuring the LT®8705 that can operate from input voltages above, below or equal to the output voltage. The demo board input range is 36V to 80V. The output is optimized for 48V at 5A, with the output current limit set at 7A. (The ...
WEBENCH Altium Connector User's Manual ®
... A transient analysis performs a time-domain analysis of your circuit over a specified time interval. Before starting the transient analysis, WBSE computes the operating point of the circuit using the time=0 values of all independent sources that have a time function. Other independent sources get th ...
... A transient analysis performs a time-domain analysis of your circuit over a specified time interval. Before starting the transient analysis, WBSE computes the operating point of the circuit using the time=0 values of all independent sources that have a time function. Other independent sources get th ...
Student Activity DOC
... situation is shown by the RC (resistor-capacitor) circuit below when the switch is closed. ...
... situation is shown by the RC (resistor-capacitor) circuit below when the switch is closed. ...
analog multimeter
... Objectives (cont’d.) – Identify the functions of a multimeter – Identify the advantages/disadvantages of DMMs and VOMs – Describe how to use a multimeter to measure voltage, current, and resistance – Describe how to measure current using an ammeter – Describe how to connect an ammeter into a circui ...
... Objectives (cont’d.) – Identify the functions of a multimeter – Identify the advantages/disadvantages of DMMs and VOMs – Describe how to use a multimeter to measure voltage, current, and resistance – Describe how to measure current using an ammeter – Describe how to connect an ammeter into a circui ...
Surface-mount technology
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.