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DATA  SHEET CGY2014TT GSM/DCS/PCS power amplifier Product specification
DATA SHEET CGY2014TT GSM/DCS/PCS power amplifier Product specification

... fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or ...
Variable resistors
Variable resistors

Evaluation Board User Guide UG-205
Evaluation Board User Guide UG-205

... As seen in Figure 1, the layout of this evaluation board is not optimized for the smallest PCB area. It is laid out in such a way that any of the components can be desoldered and replaced easily with different components with a hand soldering iron so that the user can modify the existing design with ...
PDF Data Sheet - Analog Devices
PDF Data Sheet - Analog Devices

DC115A - Demo Manual
DC115A - Demo Manual

... rail-to-rail output buffer amplifier and reference in an SO8 package that occupies just 0.1 inch2 , including a bypass capacitor. The low power supply current and small size makes these circuits ideal for portable battery-powered applications. In addition, these circuits are also used for digital ca ...
Polarity Correcting Isolated CAN Node
Polarity Correcting Isolated CAN Node

... TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguar ...
EHP-AX08EL/UB01H
EHP-AX08EL/UB01H

... ii. For Manual Soldering Process a. For prototype builds or small series production runs it is possible to place and solder the LED by hand. b. Dispense thermal conductive glue or grease on the substrates and follow its curing specifications. Gently press LED housing to closely connect LED and subst ...
Evaluation Board User Guide UG-132
Evaluation Board User Guide UG-132

... ESD Caution ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions sho ...
Ceramic Class 2 And 3 capacitors Are Not A Proper Design
Ceramic Class 2 And 3 capacitors Are Not A Proper Design

... The notion that the Polypropylene dielectric is lossy at high frequency is absolutely absurd. I have tested the Q of Polypropylene caps to over 200Mc and find their Q to be => than Ceramic class 2 or 3 caps and stability superior; See the video. The manufactures data sheets for polypropylene caps sp ...
Post Glover Dynamic Braking Resistors
Post Glover Dynamic Braking Resistors

... Ohms are specified by the drive manufacturer as the minimum required resistance and are often stated as a range. Post Glover uses a manufacturing tolerance of -0 to +5% to prevent an overcurrent condition on the drive. Watts are stated as either a maximum braking power or continuous braking power. I ...
A750 Series, 105°C
A750 Series, 105°C

... A general principle is that lower temperature operation results in a longer, useful life of the capacitor. For this reason, it should be ensured that electrolytic capacitors are placed away from heat-emitting components. Adequate space should be allowed between components for cooling air to circulat ...
Lithium Manganese Dioxide Applicatiod Guide
Lithium Manganese Dioxide Applicatiod Guide

IGC54T65R3QE High Speed IGBT3 Chip
IGC54T65R3QE High Speed IGBT3 Chip

... For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings ...
Pignose G40V 40w Tube Amp
Pignose G40V 40w Tube Amp

... The other approximate values are as follows: 1.0uF=600hz; 4.7uF=140hz; 10uF=60hz; 22uF=30hz; 220uF less than 3hz. The 0.047uF/250+v polyester cap used gives an interesting twist to the 0uF unboosted sound: it adds a bit of gain and presence to the signal, as well as brightening it up. To eliminate ...
LM3875 Gainclone - Building Instructions
LM3875 Gainclone - Building Instructions

... We do the chips and caps next. The capacitors are polarized and their orientation is critical. Each electrolytic has one pin longer and this should be installed in a pad marked with + on the board. Also, the golden stripe marks the negative side and it installs opposite the +. When those caps are mo ...
IGC28T65QE High Speed IGBT3 Chip
IGC28T65QE High Speed IGBT3 Chip

... For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings ...
IGC39T65QE High Speed IGBT3 Chip
IGC39T65QE High Speed IGBT3 Chip

... For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings ...
Arduino Nixie Clock v8 - Open Rate open source rating and mediation
Arduino Nixie Clock v8 - Open Rate open source rating and mediation

... Then, hold your breath and switch on. If you hear any angry sounding buzzing turn the power off immediately and check the orientation of C1! The circuit should run almost silently. Be careful, we are dealing with high voltages now! If all is well, measure the voltage at the “170V” test point. It is ...
AUTOMOTIVE DEVICES
AUTOMOTIVE DEVICES

... The HCRTP device has a set open temperature and can be installed using reliable, lead-free, Surface Mount Device (SMD) assembly and reflow processes. The device’s high-current capability of 90A at 23°C helps provide protection against thermal runaway for power FETs and other components if failure oc ...
SIGC156T120R2C IGBT Chip in NPT-technology
SIGC156T120R2C IGBT Chip in NPT-technology

... Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Inf ...
Recommended External Circuitry for Transphorm GaN FETs
Recommended External Circuitry for Transphorm GaN FETs

Digital I/O Board Kit (#27113)
Digital I/O Board Kit (#27113)

... The serial interface (2x5 header) allows you to reduce the number of pins required to control the Digital I/O Board by serially shifting data to/from the board over a synchronous serial interface. Whereas full control requires 16 I/O pins using the parallel interface, the serial interface can provid ...
IGC168T170S8RH
IGC168T170S8RH

... For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact t ...
Introduction to Basic Electronic Components
Introduction to Basic Electronic Components

Infrared IR Sensor Circuit Diagram and Working Principle
Infrared IR Sensor Circuit Diagram and Working Principle

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Surface-mount technology



Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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