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Determine resistors` performances in surge
Determine resistors` performances in surge

... element mass. Additionally, the surge capability can be increased by using two layers of wire and winding them in opposite directions to reduce the resistor’s inductance. Not only does this increase the inductance, but it also increases the resistance wire mass, which in turn improves the resistor’s ...
MAX4986 Evaluation Kit Evaluates: General Description Features
MAX4986 Evaluation Kit Evaluates: General Description Features

... Without R9 populated, EN is shorted to GND when a device is plugged into J1 or J2. EN must be high to test this feature. The cable detection applies only to J1 or J2. ...
IGC82T170S8RM
IGC82T170S8RM

... Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Inf ...
101 p2 _A1_ IC Characterization
101 p2 _A1_ IC Characterization

... The oscillation circuit is made up of an inverter or amplifier (inside the microcontroller) and an external ceramic resonator with load capacitors, CL1 and CL2, (see Figure 1). The oscillation frequency is calculated using the resonant frequency (Fr), static capacitance (C0), and motional capacitanc ...
IGC70T120T8RL IGBT4 Low Power Chip
IGC70T120T8RL IGBT4 Low Power Chip

... For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings ...
Parallel Resonant Circuit with Non-ideal Circuit Elements
Parallel Resonant Circuit with Non-ideal Circuit Elements

Analog Devices Welcomes Hittite Microwave Corporation
Analog Devices Welcomes Hittite Microwave Corporation

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... emf devices. The electroplaques in the type of electric fish known as a South American eel are arranged in 140 rows, each row stretching horizontally along the body and each containing 5000 electroplaques. The arrangement is suggested in Figure a; each electroplaque has an emf  of 0.15 V and an int ...
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micro DC/DC Converter

... Miniaturization and a low profile are demanded of the semiconductors and electronic components used in portable devices such as smartphones and tablets. Accompanying the lower voltages and larger currents used in semiconductors in devices, DC/DC converters, which have a higher conversion efficiency ...
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... This list shows what BBDs and corresponding clocks you can use in building the Pork Barrel. The CE-2 is traditionally a 9v effect. However, with the MN3007 you can run it at up to 12v, if you like. More voltage generally means more headroom and dynamics (keep in mind that the difference b/w 9 and 12 ...
FLEXIBLE SHEAR STRESS SENSOR SKIN FOR AERODYNAMICS APPLICATIONS
FLEXIBLE SHEAR STRESS SENSOR SKIN FOR AERODYNAMICS APPLICATIONS

... is more often used due to its higher frequency response and sensitivity which are crucial to many fluid mechanics measurements even though the bias circuit is much more complicated than the simple constant current circuit. It also requires accurate adjustment of operating point and hence is more sen ...
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SIGC186T170R3E

... Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Inf ...
Lecture 8: Symmetrical Components
Lecture 8: Symmetrical Components

... Symmetrical Components • Due to C. L. Fortescue (1918): a set of n unbalanced phasors in an n-phase system can be resolved into n balanced phasors by a linear transformation – The n sets are called symmetrical components – One of the n sets is a single-phase set and the others are n-phase balanced ...
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... guarantees, warranties, or assurances of any kind, express or implied, with respect to such information, including any information on linked sites, and including, but not limited to accuracy of the information or its completeness, timeliness, usefulness, adequacy, continued availability or ownership ...
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... BE FPGA 1: I/O signals to QDRs must be 1.5 V bank. Ok Note QDR I/O voltage 1.5V is less than Core voltage 2.5V (may change in later models). Decoupling values have been checked. Low/Mid/High ranges are Ok. Seems a lot of components but they are the minimum quantity recommended. (Note Some designers ...
SIGC84T120R3E
SIGC84T120R3E

... Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Inf ...
Evaluates: MAX3272 MAX3272 Evaluation Kit General Description Features
Evaluates: MAX3272 MAX3272 Evaluation Kit General Description Features

... *Note: U1 has an exposed pad that requires that it be solder attached to the circuit board to ensure proper functionality of the part. ...
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Overview C-Series: Low Noise, Fast, Blue-Sensitive Silicon

... Due to the extreme speed of the signals from the fast output, care should be taken in the routing of the signal. Common microwave/RF design rules, such as controlled impedance microstrip lines, should be used. The capacitance of the fast output electrode is much lower (of the order of 2-3pF for a 1m ...
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IGC36T120T8L IGBT4 Low Power Chip
IGC36T120T8L IGBT4 Low Power Chip

... For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings ...
bq20z40/45/60/65 Printed-Circuit Board Layout
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... high-current traces and ultralow-current semiconductor devices. The best way to protect against unwanted trace-to-trace coupling is with a component placement such as that shown in Figure 11, where the high-current section is on the opposite side of the board from the electronic devices. Clearly, th ...
RF3396 GENERAL PURPOSE AMPLIFIER Features
RF3396 GENERAL PURPOSE AMPLIFIER Features

... Care should also be taken in the resistor selection to ensure that the current into the part never exceeds 40mA over the planned operating temperature. This means that a resistor between the supply and this pin is always required, even if a supply near 3.4V is available, to provide DC feedback to pr ...
Triode Electronics Dynaco ST
Triode Electronics Dynaco ST

... #9 to chassis ground lug near quad cap. #10 10 ohm ground isolation resistor to pin 3 of right power take off socket. #11 to Pin 4 of V3 (EL34 tube) #12 to left channel 16 ohm tap on speaker output terminal #13 to right channel 16 ohm tap on speaker output terminal #14 to Pin 4 of V6 (EL34 tube) #15 ...
Feasibility Study of Inductor Coupling in Three- Level Neutral
Feasibility Study of Inductor Coupling in Three- Level Neutral

... based DC/AC converter performance is effective and reliable [1]–[4]. Fig. 1 illustrates a general circuit diagram of the 3L NPC qZSI based single-phase DC/AC converter. The main advantages of the converter are continuous input current, input voltage preregulation in the single stage and shoot-throug ...
CD4010B-Q1 CMOS Hex Buffer/Converter (Rev
CD4010B-Q1 CMOS Hex Buffer/Converter (Rev

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Surface-mount technology



Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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