• Study Resource
  • Explore
    • Arts & Humanities
    • Business
    • Engineering & Technology
    • Foreign Language
    • History
    • Math
    • Science
    • Social Science

    Top subcategories

    • Advanced Math
    • Algebra
    • Basic Math
    • Calculus
    • Geometry
    • Linear Algebra
    • Pre-Algebra
    • Pre-Calculus
    • Statistics And Probability
    • Trigonometry
    • other →

    Top subcategories

    • Astronomy
    • Astrophysics
    • Biology
    • Chemistry
    • Earth Science
    • Environmental Science
    • Health Science
    • Physics
    • other →

    Top subcategories

    • Anthropology
    • Law
    • Political Science
    • Psychology
    • Sociology
    • other →

    Top subcategories

    • Accounting
    • Economics
    • Finance
    • Management
    • other →

    Top subcategories

    • Aerospace Engineering
    • Bioengineering
    • Chemical Engineering
    • Civil Engineering
    • Computer Science
    • Electrical Engineering
    • Industrial Engineering
    • Mechanical Engineering
    • Web Design
    • other →

    Top subcategories

    • Architecture
    • Communications
    • English
    • Gender Studies
    • Music
    • Performing Arts
    • Philosophy
    • Religious Studies
    • Writing
    • other →

    Top subcategories

    • Ancient History
    • European History
    • US History
    • World History
    • other →

    Top subcategories

    • Croatian
    • Czech
    • Finnish
    • Greek
    • Hindi
    • Japanese
    • Korean
    • Persian
    • Swedish
    • Turkish
    • other →
 
Profile Documents Logout
Upload
No-fault-found and intermittent failures in electronic products
No-fault-found and intermittent failures in electronic products

... Terms related to NFF include trouble-not-identified (TNI), cannot duplicate (CND), no-trouble-found (NTF), and retest OK (RTOK) [1–7]. The commonality of these terms is that a failure may have occurred but cannot be verified, replicated at will, or attributed to a specific root cause, failure site, ...
Aalborg Universitet
Aalborg Universitet

... Unlike the dielectric materials of Al-Caps and MPPF-Caps, the dielectric materials of MLC-Caps are expected to last for thousands of years at use level conditions without showing significant degradation [19]. Therefore, wear out of ceramic capacitors is typically not an issue. However, a MLC-Cap cou ...
Aalborg Universitet Wang, Huai; Blaabjerg, Frede
Aalborg Universitet Wang, Huai; Blaabjerg, Frede

... Unlike the dielectric materials of Al-Caps and MPPF-Caps, the dielectric materials of MLC-Caps are expected to last for thousands of years at use level conditions without showing significant degradation [19]. Therefore, wear out of ceramic capacitors is typically not an issue. However, a MLC-Cap cou ...
MAX16977 Evaluation Kit Evaluates: MAX16977 General Description Features
MAX16977 Evaluation Kit Evaluates: MAX16977 General Description Features

... • Electronic load capable of 2A ...
Evaluates:  MAX4993 MAX4993 Evaluation Kit General Description Features
Evaluates: MAX4993 MAX4993 Evaluation Kit General Description Features

... MAX4993 DPDT analog switch in a 1.4mm x 1.8mm 10pin ultra-thin QFN package specified for operating over the -40°C to +85°C extended temperature range. The IC’s slow turn-on time provides click-and-pop reduction without additional parts in portable audio applications. The IC features low 0.3Ω RON res ...
Test Point Diagram
Test Point Diagram

Modeling a Circuit that Represents an Electrolytic Solution at
Modeling a Circuit that Represents an Electrolytic Solution at

... The main purpose of this experiment is to find the basic characteristics of an electrolyte solution. These results can be compared to many different scenarios. For example, biosensors is a small tool that measures a wide variety of living organisms. We can model these organisms as an electrolyte bec ...
Quadruple Positive-NAND Gates With Schmitt
Quadruple Positive-NAND Gates With Schmitt

UM1494
UM1494

... designers to debug the software with a computer directly connected to the STM8SDISCOVERY kit. Therefore, this demonstration board can also be used to evaluate optotransistor circuits in applications where isolation between mains and control parts is required, such as high-end washing machines, dishw ...
MAX17116Q Evaluation Kit Evaluates: MAX17116 in a 24-Pin TQFN Package General Description Features
MAX17116Q Evaluation Kit Evaluates: MAX17116 in a 24-Pin TQFN Package General Description Features

... The EV kit features a 3-pin jumper (JU1) to control the enable input and an EN test pad to access the serial interface input. Connect EN to IN for normal operation. Connect EN to AGND to place the device into shutdown mode. The enable pin is also used as a serial-interface input to adjust the invert ...
Identify Common Circuit Components and Their Symbols
Identify Common Circuit Components and Their Symbols

... TACC resources are still in use by a number of trades programs today and, with the permission from the Industry Training Authority (ITA), have been utilized in this project. These open resources have been updated and realigned to match many of the line and competency titles found in the Province of ...
FEATURES TYPICAL APPLICATION CIRCUITS  ADP150UJZ-REDYKIT
FEATURES TYPICAL APPLICATION CIRCUITS ADP150UJZ-REDYKIT

... ESD Caution ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions sho ...
HMC427LP3 / 427LP3E
HMC427LP3 / 427LP3E

Basic Quantities
Basic Quantities

... Current is moving positive electrical charge. Measured in Amperes (A) = 1 Coulomb/s Current is represented by I or i. In general, current can be an arbitrary function of time. Constant current is called direct current (DC).  Current that can be represented as a sinusoidal function of time (or in so ...
Gr X Physics Practicals Instructions: Please write these experiments
Gr X Physics Practicals Instructions: Please write these experiments

... 6. Now both Resistors R1 and R2 are connected in parallel as shown in the circuit and voltmeter and ammeter readings are noted. 7. The procedure is repeated for 3 times by adjusting the rheostat. 8. Values of R1, R2 and Rp are calculated using the formula. Precautions: 1. When not in use, switch off ...
PBSS9110D 1. Product profile 100 V, 1 A PNP low V
PBSS9110D 1. Product profile 100 V, 1 A PNP low V

... representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limi ...
μ PA2379T1P  Data Sheet
μ PA2379T1P Data Sheet

... 2. Please do not damage the device when you handle it. The use of metallic tweezers has the possibility of giving the wound. Mounting with the nozzle with clean point is recommended. 3. When you mount the device on a substrate, carry out within our recommended soldering conditions of infrared reflow ...
MAX4951AE Evaluation Kit Evaluates: General Description Features
MAX4951AE Evaluation Kit Evaluates: General Description Features

... The MAX4951AE evaluation kit (EV kit) provides a proven design to evaluate the MAX4951AE dual-channel buffer. The EV kit contains four sections: application circuit, characterization circuit, and two sets of calibration traces. The application circuit is designed to demonstrate the MAX4951AE IC’s us ...
Qucs Help Documentation
Qucs Help Documentation

... window opens and a sliding bar reports simulation progress. Normally, all this happens so fast that you only see a short flickering on the PC display (this depends on the speed of your PC). After finishing a simulation successfully Qucs opens a data display window. This replaces the schematic entry ...
Test Procedure: Fault Finding Circuits
Test Procedure: Fault Finding Circuits

893D Solid Tantalum Surface Mount Chip Capacitors
893D Solid Tantalum Surface Mount Chip Capacitors

laser in-circuit
laser in-circuit

... The function is detected, and while it is continuously detected, trimming is started. The trimming continues with decreasing capacitance until the requested function and tolerance of function is reached. ...
Evaluation Board User Guide UG-312
Evaluation Board User Guide UG-312

... ESD Caution ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions sho ...
(PGM) Light Dependent Resistors
(PGM) Light Dependent Resistors

... A typical structure for a photoresistor uses an active semiconductor layer that is deposited on an insulating substrate. The semiconductor is normally lightly doped to enable it to have the required level of conductivity. Contacts are then placed either side of the exposed area. The photo-resistor, ...
DIP IPM Vers.3 Demo Board (1200V) Manual
DIP IPM Vers.3 Demo Board (1200V) Manual

... as from the pin-header to the DIP-IPM terminals should be as short as possible to avoid EMI disturbances and unwanted switching of the IPM. The same precautions – tracks as short as possible - have been applied to the board design itself. The bootstrap supply area contains of an ultrafast (trr=75ns) ...
< 1 ... 31 32 33 34 35 36 37 38 39 ... 161 >

Surface-mount technology



Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
  • studyres.com © 2025
  • DMCA
  • Privacy
  • Terms
  • Report