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AN-2134 LMZ13610/8/6 and LMZ12010/8/6
AN-2134 LMZ13610/8/6 and LMZ12010/8/6

... harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With ...
Using Laser Trimmable Resistors
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... frequency or gain (active trim). The following factors have to be considered: • The resistive layer has to be vaporized while minimizing the penetration into the underlying ceramic. • The laser beam must be in focus. Otherwise the power density decreases rapidly, resulting in incomplete material rem ...
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... The PCA9547 is an octal bidirectional translating multiplexer controlled by the I2C-bus. The SCL/SDA upstream pair fans out to eight downstream pairs, or channels. Only one SCx/SDx channel can be selected at a time, determined by the contents of the programmable control register. The device powers u ...
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... position. The mother board SPI MOSI drives U1 DIN through JU3, then U1 DOUT drives the mother board SPI MISO through JU5. The mother board SPI MOSI drives U3 DIN directly, and U3 DOUT drives the mother board SPI MISO through JU12. U1 and U3 have different CONVST signals in this mode, with U1 CONVST ...
AP Physics Free Response Practice – Circuits 1976B3. In the circuit
AP Physics Free Response Practice – Circuits 1976B3. In the circuit

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... board for shorted tracks or any breaks in the copper pattern. Check the pattern against the published artwork to verify that it is correct. Repair any defects on the PC board before starting assembly. Fig.2 shows the component overlay for the PC board. First, install all the links on the PC board. T ...
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... step-up switching regulator, two charge-pump voltageregulator circuits, a VCOM buffer, and a low-drop out linear regulator (LDO). The step-up switching circuit is configured for a +8V output that provides up to 250mA of current from a +3.0V supply. The EV kit can be powered from a +2.7V to +5.5V sup ...
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Surface-mount technology



Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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