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Optimum Placement of Decoupling Capacitors on
Optimum Placement of Decoupling Capacitors on

Lecture 9: Electric Current
Lecture 9: Electric Current

... Real batteries are constructed from materials which possess non-zero resistivities. It follows that real batteries are not just pure voltage sources. They also possess internal resistances. A pure voltage source is usually referred to as an emf (which stands for electromotive force). Electric cells ...
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RTCMag-ThermalMgmt-TightSpaces-SWA-OK

... The third stage is the layout level for which both the design engineer and the PCB designers being responsible. It’s in the best interest of the design engineer to identify PCB hotspots that need to be communicated to the designer, who in turn will use good layout practices with PCB thermal perform ...
Evaluate:  MAX8530/MAX8531 MAX8530/MAX8531 Evaluation Kit General Description Features
Evaluate: MAX8530/MAX8531 MAX8530/MAX8531 Evaluation Kit General Description Features

... low-noise MAX8531 in a 6-pin UCSP™ package is used for this circuit. PC board pads for the SHDN signal are provided on the circuit to interface with an external controller. The MAX8530/MAX8531 EV kit provides on-board shutdown control as well as a jumper-selectable RESET output voltage for the MAX85 ...
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MAX44260 Evaluation Kit Evaluates: MAX44260 General Description Features
MAX44260 Evaluation Kit Evaluates: MAX44260 General Description Features

... operation. The 1-2 position of JU2 enables the device. 3) Connect the positive terminal of the +5V supply to the VCC PCB pad. Connect the negative terminal of the power supply to the GND PCB pad nearest VCC. 4) Connect the positive terminal of the precision voltage source to the INP test point. Co ...
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... cell or battery. The current does NOT get used up by a circuit, just the energy the electrons are carrying. A1 = A4 The current splits up at the first junction and then joins together at the second junction. If the bulbs are identical then the current will split evenly. If the bulbs are NOT identica ...
Xilinx Design Hints and Issues
Xilinx Design Hints and Issues

... CMOS ICs are no longer the slow and forgiving circuits of the past. They are now as fast as (if not faster than) the fastest TTL circuits; outputs ramp between 0 and 5 volts in 1 ns, clock rates approach 150 MHz, and ICs have up to 500 signal connections to accommodate multiple 32-bit wide busses. T ...
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Film capacitors - Power Factor Correction

...  Check the discharge resistors/reactors and in case of doubt, check their function: (1) Power the capacitor up and down. (2) After ≤ 90 seconds the voltage between the terminals must decline to less than 75 V.  Check the temperature of capacitors directly after operation for a longer period, but m ...
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MAX9986EVKIT.pdf
MAX9986EVKIT.pdf

... the PC board ground plane with a low-thermal and electrical impedance contact. Ideally, this is achieved by soldering the backside of the package directly to a top metal ground plane on the PC board. Alternatively, the EP can be connected to an internal or bottom-side ground plane using an array of ...
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chapter18

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MAX15034B Evaluation Kit Evaluates: General Description Features

... dual-output buck converter with a 5V to 16V input voltage range. The MAX15034B EV kit provides dual 1.2V output voltages (VOUT1 and VOUT2). It delivers up to 20A output current for each output with 86.7% efficiency. The MAX15034B EV kit uses average current-mode control and operates at 300kHz switch ...
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... There are two general ways in which variable resistors are used. One is the variable resistor whose value is easily changed, like the volume adjustment of Radio. The other is semi-fixed resistor that is not meant to be adjusted by anyone but a technician. It is used to adjust the operating condition ...
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... G6A07 Which of the following is a reason not to use wire-wound resistors in an RF circuit? A. The resistor's tolerance value would not be adequate for such a circuit B. The resistor's inductance could make circuit performance unpredictable C. The resistor could overheat D. The resistor's internal c ...
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Evaluates:  MAX3680 MAX3680 Evaluation Kit _______________General Description ____________________________Features
Evaluates: MAX3680 MAX3680 Evaluation Kit _______________General Description ____________________________Features

... The MAX3680 evaluation kit (EV kit) simplifies evaluation of the MAX3680 622Mbps, SDH/SONET 1:8 deserializer. The EV kit requires only a +3.3V supply, and includes all the external components necessary to interface with 3.3V PECL/TTL logic. The board can be connected directly to the output of a cloc ...
MAX9993 EV kit
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... device and provides a low-impedance electrical connection to the ground plane. The EP must be attached to the PC board ground plane with a low thermal and electrical impedance contact. Ideally, this is achieved by soldering the backside of the package directly to a top metal ground plane on the PC b ...
MODSIX_7971 GENII V7 Clock assembly notes
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... install the GPS connector BEFORE  the RF­MODULE.  For custom builds the connector could possibly be top mounted, but the GPS signal and power pins would be moved, and the connector would physically interfere with the RF­MODULE’s normal placement. RF1 ­ 2.4ghz RF­MODULE.  The module is normally inst ...
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iC-SG85 SG4C - iC-Haus

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TM-1001 PS Word - White Oak Audio

... Populate each diode/rectifier in the PCB according to the proper value/location. Splay the leads of each diode/rectifier slightly on the solder side of the board to keep the diode retained in the PCB. Carefully flip over the PCB and solder each diode/rectifier lead to the board. Clip excess lead len ...
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... with the optional Power-1 module that acts as an electronic flywheel. The Bachmann printed circuit board has two coils (L1, L2) and two capacitors (C3, C4) that filter the motor circuit to meet some of the European regulations. Reports are that they may cause problems with DCC and I removed them. I ...
130 In One Electronics Lab Tutorial
130 In One Electronics Lab Tutorial

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Surface-mount technology



Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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