Secong Order Circuit
... Three steps to find out the step response of an RL circuit: 1. The initial inductor current i(0) at t = 0+. 2. The final inductor current i(). 3. The time constant . ...
... Three steps to find out the step response of an RL circuit: 1. The initial inductor current i(0) at t = 0+. 2. The final inductor current i(). 3. The time constant . ...
The Rules of Parallel Circuits
... impedance. Ever wonder why? It’s because, when you connect a voltmeter to measure circuit voltage, you’re creating a parallel circuit between that circuit and the meter. If the meter’s resistance is too low, its additional circuitry will alter the total resistance of the circuit. That can change the ...
... impedance. Ever wonder why? It’s because, when you connect a voltmeter to measure circuit voltage, you’re creating a parallel circuit between that circuit and the meter. If the meter’s resistance is too low, its additional circuitry will alter the total resistance of the circuit. That can change the ...
Applying Short Circuit Current and Series
... UL Recognized Component Directory. Another source of information for series-connected ratings is published literature from the manufacturer. Underwriters Laboratories also allows series ratings between different manufacturer’s products. An example of this is fuse/circuit breaker seriesconnected rati ...
... UL Recognized Component Directory. Another source of information for series-connected ratings is published literature from the manufacturer. Underwriters Laboratories also allows series ratings between different manufacturer’s products. An example of this is fuse/circuit breaker seriesconnected rati ...
UG-470 - Analog Devices
... ESD Caution ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions sho ...
... ESD Caution ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions sho ...
DP83865 Gig PHYTER V 10/100/1000 Ethernet
... maximized by reducing the plane spacing. In addition, filling unused board areas on signal planes with copper and connecting them to the proper power plane will also increase the interplane capacitance. The 2.5 V and the 1.8 V supply pins are paired with their corresponding ground pins. Every other ...
... maximized by reducing the plane spacing. In addition, filling unused board areas on signal planes with copper and connecting them to the proper power plane will also increase the interplane capacitance. The 2.5 V and the 1.8 V supply pins are paired with their corresponding ground pins. Every other ...
BJT Small-Signal Analysis Steps
... terminal of a resistor is connected to ground, then that resistor terminal is connected to the emitter! * As a result, you often find that resistors in different parts of the circuit are actually connected in parallel, and thus can be combined to simplify the circuit schematic! * Finally, note that ...
... terminal of a resistor is connected to ground, then that resistor terminal is connected to the emitter! * As a result, you often find that resistors in different parts of the circuit are actually connected in parallel, and thus can be combined to simplify the circuit schematic! * Finally, note that ...
Embedded Capacitance Fabrication Process Guide
... solder mask thermal cure temperature should not exceed 200º C (392º F). The material is also compatible with all common surface finishes, including organic solderability preservatives (OSP), hot air solder leveling (HASL), immersion silver and electroless nickel-immersion gold (ENIG). No changes to ...
... solder mask thermal cure temperature should not exceed 200º C (392º F). The material is also compatible with all common surface finishes, including organic solderability preservatives (OSP), hot air solder leveling (HASL), immersion silver and electroless nickel-immersion gold (ENIG). No changes to ...
AN-336 Understanding Integrated Circuit
... Infant mortality, the high failure rate from time t0 to t1 (early life), is greatly influenced by system stress conditions other than temperature, and can vary widely from one application to another. The main stress factors that contribute to infant mortality are electrical transients and noise, mec ...
... Infant mortality, the high failure rate from time t0 to t1 (early life), is greatly influenced by system stress conditions other than temperature, and can vary widely from one application to another. The main stress factors that contribute to infant mortality are electrical transients and noise, mec ...
The Role of Packaging in Microelectronics
... IC Packaging Classification SMT (surface-mount-technology) SMT packages have leads that are soldered directly to corresponding exposed metal lands on the surface of the circuit board » Elimination of holes » Ease of manufacturing (high-speed P&P) » Components on both sides of the PCB » Smaller dimen ...
... IC Packaging Classification SMT (surface-mount-technology) SMT packages have leads that are soldered directly to corresponding exposed metal lands on the surface of the circuit board » Elimination of holes » Ease of manufacturing (high-speed P&P) » Components on both sides of the PCB » Smaller dimen ...
HMC224MS8 / 224MS8E
... The HMC224MS8 & HMC224MS8E are low-cost SPDT switches in 8-lead MSOP packages for use in transmit-receive applications. The device can control signals from 5.0 to 6.0 GHz and is especially suited for 5.2 GHz UNII and 5.8 GHz ISM applications with only 1.2 dB loss. The design provides exceptional pow ...
... The HMC224MS8 & HMC224MS8E are low-cost SPDT switches in 8-lead MSOP packages for use in transmit-receive applications. The device can control signals from 5.0 to 6.0 GHz and is especially suited for 5.2 GHz UNII and 5.8 GHz ISM applications with only 1.2 dB loss. The design provides exceptional pow ...
Interrupting Capacity vs. Interrupting Rating
... not assure that the circuit breaker’s interrupting capacity equals its interrupting rating nor even that the circuit breaker is reusable. In this test, line and load terminals are connected to 10 inches of rated conductor. For single pole circuit breakers, these 10 inch leads are then connected to 4 ...
... not assure that the circuit breaker’s interrupting capacity equals its interrupting rating nor even that the circuit breaker is reusable. In this test, line and load terminals are connected to 10 inches of rated conductor. For single pole circuit breakers, these 10 inch leads are then connected to 4 ...
TJA1048 1. General description Dual high-speed CAN transceiver with Standby mode
... transmitter and Normal-mode receiver blocks are switched off to reduce supply current, and only a low-power differential receiver monitors the bus lines for activity. In Standby mode, the bus lines are biased to ground to minimize the system supply current. The low-power receiver is supplied by VIO, ...
... transmitter and Normal-mode receiver blocks are switched off to reduce supply current, and only a low-power differential receiver monitors the bus lines for activity. In Standby mode, the bus lines are biased to ground to minimize the system supply current. The low-power receiver is supplied by VIO, ...
capacitors for rfi suppression of the ac line
... to ground may require a Y1 type. All four classes are described in order of their popularity. Class Y2 The most popular type. Such a capacitor is allowed to bridge basic and supplementary insulation with line voltages up to 250VAC (nominal). This is the normal case for power supplies used in data pr ...
... to ground may require a Y1 type. All four classes are described in order of their popularity. Class Y2 The most popular type. Such a capacitor is allowed to bridge basic and supplementary insulation with line voltages up to 250VAC (nominal). This is the normal case for power supplies used in data pr ...
Surface-mount technology
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.