multiplier
... The five multipliers selected qualitatively are given in [5], [6], [7], [8] and [9]. These five multipliers were designed without optimizing a specific performance for a rough comparison through simulation. All the multipliers had transistors of same dimensions and were subjected to dc analysis, pow ...
... The five multipliers selected qualitatively are given in [5], [6], [7], [8] and [9]. These five multipliers were designed without optimizing a specific performance for a rough comparison through simulation. All the multipliers had transistors of same dimensions and were subjected to dc analysis, pow ...
Virtex-5 FPGA PCB Designer’s Guide www.BDTIC.com/XILINX UG203 (v1.4) April 20, 2009
... substrate material (usually FR4, an epoxy/glass composite) with copper plating on both sides has portions of copper etched away to form conductive paths. Layers of plated and etched substrates are glued together in a stack with additional insulator substrates between the etched substrates. Holes are ...
... substrate material (usually FR4, an epoxy/glass composite) with copper plating on both sides has portions of copper etched away to form conductive paths. Layers of plated and etched substrates are glued together in a stack with additional insulator substrates between the etched substrates. Holes are ...
MAX1385EVC16-MAX1385EVKIT.pdf
... may be saved to a file. Only the raw output codes are saved, but voltages may be inferred based on the reference voltage and the maximum code value. ...
... may be saved to a file. Only the raw output codes are saved, but voltages may be inferred based on the reference voltage and the maximum code value. ...
Atmel AVR042: AVR Hardware Design Considerations 8-bit Atmel
... The pull-up resistor can in theory be of any size, but if the Atmel AVR should be programmed from e.g. STK500/AVRISP the pull-up should not be so strong that the programmer cannot activate RESET by draw the RESET line low. The recommended pull-up resistor is 4.7kΩ or larger when using STK500 for pro ...
... The pull-up resistor can in theory be of any size, but if the Atmel AVR should be programmed from e.g. STK500/AVRISP the pull-up should not be so strong that the programmer cannot activate RESET by draw the RESET line low. The recommended pull-up resistor is 4.7kΩ or larger when using STK500 for pro ...
Datasheet
... Pin TXDx is pulled down to ground in order to force a predefined level on the transmit data input if the pin is disconnected. Pin SLPx_N is pulled down to ground to ensure that the transceiver is forced to Sleep x mode if SLPx_N is disconnected. Pins RXD1 and RXD2 are set floating if VBAT1 is discon ...
... Pin TXDx is pulled down to ground in order to force a predefined level on the transmit data input if the pin is disconnected. Pin SLPx_N is pulled down to ground to ensure that the transceiver is forced to Sleep x mode if SLPx_N is disconnected. Pins RXD1 and RXD2 are set floating if VBAT1 is discon ...
Folie 1 - RWTH Aachen University
... powered on/off In a scenario with one charge pump employed per chip, individual chips can be powered on/off Note: with SP, the whole chain is powered on at once from a constant current source PS. If a module needs to be bypassed, its current must be shunted and burned in regulators, which leads to ...
... powered on/off In a scenario with one charge pump employed per chip, individual chips can be powered on/off Note: with SP, the whole chain is powered on at once from a constant current source PS. If a module needs to be bypassed, its current must be shunted and burned in regulators, which leads to ...
Self-test GFCI with wire leads spec sheet
... Flammability: Meets UL 94 requirements; V2 rated Temperature rating: -35ºC to 66ºC (-31ºF to 150.8ºF) Dielectric voltage: Withstands 2000V per UL 498 Current interrupting: Yes, at full-rated current Temperature rise: Max. 30ºC (86°F) after 100 cycles of overload @ 150% of rated current (DC) Trip ti ...
... Flammability: Meets UL 94 requirements; V2 rated Temperature rating: -35ºC to 66ºC (-31ºF to 150.8ºF) Dielectric voltage: Withstands 2000V per UL 498 Current interrupting: Yes, at full-rated current Temperature rise: Max. 30ºC (86°F) after 100 cycles of overload @ 150% of rated current (DC) Trip ti ...
TJA1028
... 1. General description The TJA1028 is a LIN 2.0/2.1/SAE J2602 transceiver with an integrated low-drop voltage regulator. The voltage regulator can deliver up to 70 mA and is available in 3.3 V and 5.0 V variants. TJA1028 facilitates the development of compact nodes in Local Interconnect Network (LIN ...
... 1. General description The TJA1028 is a LIN 2.0/2.1/SAE J2602 transceiver with an integrated low-drop voltage regulator. The voltage regulator can deliver up to 70 mA and is available in 3.3 V and 5.0 V variants. TJA1028 facilitates the development of compact nodes in Local Interconnect Network (LIN ...
Complete ECE 112 Manual
... turned off, use only one hand when working on it. This will prevent a circuit from being going through your heart, which could be potentially fatal. ...
... turned off, use only one hand when working on it. This will prevent a circuit from being going through your heart, which could be potentially fatal. ...
MAX44006 Evaluation System Evaluates: MAX44006 General Description
... | Programs menu. During software installation, some ...
... | Programs menu. During software installation, some ...
Generalized Time- and Transfer-Constant Circuit
... the expected experimental outcome accurately on a computer before testing going to the lab. However, these absolutely necessary tools are not sufficient for analog circuit design, which by its nature is open-ended and divergent. This necessitates analytical techniques that can provide insight into h ...
... the expected experimental outcome accurately on a computer before testing going to the lab. However, these absolutely necessary tools are not sufficient for analog circuit design, which by its nature is open-ended and divergent. This necessitates analytical techniques that can provide insight into h ...
Non-alloyed Ohmic contact
... Issue 2 : Small RS → Small LGS, Small RC - Self align gate process → Good gate length uniformity Millimeter-wave Device & Circuit Lab. (MDCL) ...
... Issue 2 : Small RS → Small LGS, Small RC - Self align gate process → Good gate length uniformity Millimeter-wave Device & Circuit Lab. (MDCL) ...
Full paper template_PEMD - International Conference on Lightning
... equations from [8, 9] assuming a copper foil winding. There are multiple solutions that satisfy the converter requirement, for each core, trading the gap length against an increasing number of turns. The results allow a comparison of suitable designs by individual loss mechanisms as well as total ...
... equations from [8, 9] assuming a copper foil winding. There are multiple solutions that satisfy the converter requirement, for each core, trading the gap length against an increasing number of turns. The results allow a comparison of suitable designs by individual loss mechanisms as well as total ...
Conference Sample Paper
... equations from [8, 9] assuming a copper foil winding. There are multiple solutions that satisfy the converter requirement, for each core, trading the gap length against an increasing number of turns. The results allow a comparison of suitable designs by individual loss mechanisms as well as total ...
... equations from [8, 9] assuming a copper foil winding. There are multiple solutions that satisfy the converter requirement, for each core, trading the gap length against an increasing number of turns. The results allow a comparison of suitable designs by individual loss mechanisms as well as total ...
Suspended Bicore.
... the master alone. This however can only be done to a certain extend since for a frequency which is too high the slave is not able to follow the master anymore: its frequency will then be smaller than the frequency of the master. A possible application for the master-slave dual bicore is as driving-c ...
... the master alone. This however can only be done to a certain extend since for a frequency which is too high the slave is not able to follow the master anymore: its frequency will then be smaller than the frequency of the master. A possible application for the master-slave dual bicore is as driving-c ...
PTN3360B 1. General description Enhanced performance HDMI/DVI level shifter
... differential signaling on the source side, to TMDS-type DC-coupled differential current-mode signaling terminated into 50 Ω to 3.3 V on the sink side. Additionally, the PTN3360B provides a single-ended active buffer for voltage translation of the HPD signal from 5 V on the sink side to 3.3 V on the ...
... differential signaling on the source side, to TMDS-type DC-coupled differential current-mode signaling terminated into 50 Ω to 3.3 V on the sink side. Additionally, the PTN3360B provides a single-ended active buffer for voltage translation of the HPD signal from 5 V on the sink side to 3.3 V on the ...
香港考試局
... 23. A parallel-plate capacitor is charged by a constant voltage source. With the plates disconnected from the source, the plate separation, d, is then gradually increased from an initial value d0. Which of the following graphs best shows the relationship between the energy, U, stored in the capacito ...
... 23. A parallel-plate capacitor is charged by a constant voltage source. With the plates disconnected from the source, the plate separation, d, is then gradually increased from an initial value d0. Which of the following graphs best shows the relationship between the energy, U, stored in the capacito ...
PCA9517A 1. General description Level translating I
... The size of these pull-up resistors depends on the system, but each side of the repeater must have a pull-up resistor. This part designed to work with Standard mode and Fast mode I2C-bus devices in addition to SMBus devices. Standard mode I2C-bus devices only specify 3 mA output drive; this limits t ...
... The size of these pull-up resistors depends on the system, but each side of the repeater must have a pull-up resistor. This part designed to work with Standard mode and Fast mode I2C-bus devices in addition to SMBus devices. Standard mode I2C-bus devices only specify 3 mA output drive; this limits t ...
Surface-mount technology
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.