Download C5_Photoconductor_ASTEQ

PACS IHDR
12/13 Nov 2003
Photoconductor
Detector Modules
IHDR
• ASTEQ-GmbH • Germany
Peter Dinges, Michael Harr, Heribert Krüger, Hilmar Richter,
Bernd Zimmermann
Photoconductor Detector Modules
1
PACS IHDR
12/13 Nov 2003
Overview
•
•
•
Completely Integrated Module
Integrated QM Modules with FEEs
RM Modules without FEEs
•
•
•
Optical / Mechanical Module <=> Camera Housing Interface
Module Design
– Electrical Interface
– Thermal Budget
– Support Post Stability: Cryovibration Tests
Detector Stack and Final Bias Design
Achieved Performance
– Cut-off Wavelengths
PA / QA Activities: Manufacturing Flow Plan
•
•
Procurement of Parts for / Assembling of Flight Modules
Summary
•
•
Photoconductor Detector Modules
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PACS IHDR
12/13 Nov 2003
Completely Integrated High Stress Module
Leaf spring
FO
<= Cavity =>
FEE
Pigtail
Harness
Cooling
strap
Photoconductor Detector Modules
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12/13 Nov 2003
Integrated QM Modules with FEE
11 HS Modules and 12 LS Modules
All modules did not have back-outs!
QM HS with FEE
Module
S/N
FO
QM FEE
FM 04
29
76
A02-038-15
FM 11
56
104
A02-527-01
HS module QM 03 (LENS) has been cryovibrated
QM 03 has seen 28x cool downs to 4 K
FEE "cycled"
Pecularities
Module repair
4 K Cool downs Cryovibrytion
n
Scratches onto pixels 7, 8, 12, 14
PACS-NT-RR-026
4
n
n
Small longitudinal crack (?) over a
PACS-NT-RR-007
6
n
third of pixel 5
n
Small scratches onto pixels 12, 14
n
4
n
y
n
5
n
y
n
11
n
n
n
10
n
n
Scratch onto pixel 7,
PACS-NT-RR-006
11
n
scratches onto FEE substrate because
of intensive R measurements
FM 14
QM 04
QM 05
QM 07
QM 08
79
36
38
42
43
82
84
56
90
87
A02-527-11
A02-038-23
A02-038-28
A02-038-11
A02-038-25
QM 09
QM 10
44
45
88
89
A02-038-12
A02-038-13
n
n
Longitudinal crack over pixel 8
PACS-NT-GR-005
n
n
QM 11
33
QM 12
48
QM LS with FEE
FM 26
35
FM 27
58
FM 34
66
FM 39
71
FM 40
72
FM 41
73
FM 42
74
QM 20
28
QM 21
39
QM 22
40
QM 23
41
QM 24
46
93
91
A02-038-21
A02-038-10
y
n
Longitudinal crack over pixel 6
-
n
n
99
92
97
105
69
100
101
98
70
71
106
72
A02-038-16
A02-038-19
A02-038-22
A02-038-04
A02-038-05
A02-038-29
A02-038-30
A02-038-17
A02-038-20
A02-038-02
A02-038-03
A02-038-14
n
n
n
n
n
n
n
y
y
n
n
n
-
Photoconductor Detector Modules
PACS-NT-RR-010
PACS-NT-RR-011
PACS-NT-RR-001
n
n
n
PACS-NT-RR-012
n
n
n
n
PACS-NT-RR-009
6
10
+ (25x to LN2)
9
6
n
n
6
18
12
15
11
6
11
11
12
7
7
15
+ (25x LN2)
n
n
n
y
y
n
n
y
n
y
y
n
n
n
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12/13 Nov 2003
RM Modules without FEE: 13 HS Modules and 14 LS Modules
RM HS
Module
S/N
Dummy QM 19 20
Dummy QM 01
FM 01
10
49
FM 02
FM 03
FM 05
52
30
47
FM 06
FM 07
FM 08
FM 09
FM 10
FM 13
FM 15
FM 16
RM LS
FM 28
53
50
51
54
55
58
80
86
FM 29
61
FM
FM
FM
FM
FM
FM
FM
FM
FM
30
31
32
33
35
36
37
38
43
FM 44
FM 45
60
FO
86
Pecularities
Scratches onto pixels 8, 9
63 Dummy without signal-bias wires
108 Scratch onto pixel 2, residues onto pixels 3, 4, 14, glue dot
onto pixel 7;
Resistor SHD # 1
74 Scratches onto pixels 2, 7, 8, 16
57 Scratches onto pixels 1, 2, 11, 15
77 Scratches onto pixels 7; very small slit of detector contact
to the cavity wall of pixel 6
52 Scratches onto pixels 11
78 65 Scratch onto pixels 6, 7, 14, glue dot onto pixels 3, 9, 14
59 60 61 Scratch onto pixels 1, 9 ,11
62 Scratch onto pixels 2, 7
102 Scratch onto pixels 2, 16
53
Module repair
4 K Cool downs Cryovibrytion
PACS-NT-RR-035
4
n
PACS-NT-RR-034
10
n
n
2
n
n
4
n
PACS-NT-RR-027
2
n
PACS-NT-RR-028
2
n
PACS-NT-RR-029
2
n
PACS-NT-RR-030
4
n
n
4
n
PACS-NT-RR-031
4
n
PACS-NT-RR-032
2
n
PACS-NT-RR-033
2
n
2
n
2
n
PACS-NT-RR-013
18
n
PACS-NT-RR-014
12
n
62
63
64
65
67
68
69
70
75
Small longitudinal crack (?) onto pixel 7,
scratches onto pixels 8, 14, 15
96 Small longitudinal crack (?) onto pixels 9, 15,
scratches onto pixels 3, 6, 14, 15
103 Scratch onto pixels 2, 6
66 Scratch onto pixels 9, 10
67 Scratch onto pixels 3
68 58 Resistor SHD # 2
55 80 Scratch onto pixels 5
81 Scratch onto pixels 7, 10
54 Scratch onto pixel 2, glue dot onto pixel 1
PACS-NT-RR-015
PACS-NT-RR-016
PACS-NT-RR-017
PACS-NT-RR-018
PACS-NT-RR-019
PACS-NT-RR-020
PACS-NT-RR-021
PACS-NT-RR-022
PACS-NT-RR-025
8
2
2
12
4
2
2
4
4
n
n
n
n
n
n
n
n
n
76
77
107 Scratch onto pixel 11
64 -
PACS-NT-RR-024
PACS-NT-RR-023
2
4
n
n
Photoconductor Detector Modules
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Optical / Mechanical Module <==> Camera Interface
Radial arrangement of 25 high
stress modules in groups of 5
modules. The centre of the
radial arrangement is 240 mm in
front of the fore optics in the
plane of the pupil.
Photoconductor Detector Modules
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12/13 Nov 2003
Electrical Interface
Interface design
•
•
•
The nano connector of the pigtail harness is glued to the harness substrate
Thermal loads from the CRE flow via the Au wires between FEE and harness through the
cooling strap to the 4 K level
To minimalise thermal load to the module:
–
–
•
Kapton supports for FEE and harness substrate
All wires from the module to electrical interface parts are stainless steel;
Problem under investigation: Ca. 5% of measured pixels “strange”! Contact resistance (?)
between stainless steel wire and H20E
Photoconductor Detector Modules
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Thermal Budget
25 Low Stress Modules
25 High Stress Modules
2.5 K
1.7 K
4K
4K
16 Detector
Wires (Steel)
11 µW
202 µW
4 Long FEE + 2 Long Harness Posts
(Kapton)
7 µW
162 µW
P = 375 µW
2 Short Harness Posts
(Kapton)
134 µW
108 µW
P = 249 µW
P = 624 µW
Photoconductor Detector Modules
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Support Post Stability: Cryovibration Test
Free bearing support post
Kompression
Bending
Slit
Free
bearing
Locating
bearing
Safety Factor (Calculation): 5
Locating
bearing
Free
bearing
Safety Factor (Calculation): 54
• 200 um Slit between kapton tube and support part (no gluing) at the free
bearing support posts:
- Compensation of thermal expansion coefficient for different materials (module,
FEE/harness substrate, kapton tube, etc.) during cool-down.
- After cool-down: slit = 0 - 50 um.
•
Static tests at LN2 temperatures: Design withstands forces corresponding up to
accelerations of 110 g.
•
Above support post design passed cryo cycling and vibration tests with qualification
load levels.
Photoconductor Detector Modules
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PACS IHDR
12/13 Nov 2003
Detector Stack in the Cavity and Final Bias Design
2
Detector Stack
Ball segment
Detector contact
1
Ge:Ga crystal
Detector contact
Final design
•
Bias concept has been changed to avoid detector short
circuiting
– Contact diameter decreased at the ball segment
side to prevent grounding of the signal line (2)
– Contact diameter increased at the ground side
(this contact is grounded directly to the module (1)
Insulator
Gold wire 25 µm

Slits reduced from 30 - 70 µm to 10 - 40 µm
and therefore less cross talk
Photoconductor Detector Modules
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Specification Cut-off Wavelength
Specification high stress module:
lCW > 200 µm @ 40 mV
Specification low stress module:
125 < lCW <130 µm @ 100 mV
Min
Max
135
Min
Max
l CW (µm)
l CW (µm)
205
200
30 mV
130
195
125
190
0
2
4
6
8
QM # - HS
Photoconductor Detector Modules
10
12
12
14
16
18
20
22
24
QM # - LS
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PA / QA Activities: Manufacturing Flow (PACS-NT-PL-003)
Cleaning and incoming
inspection of all
mechanical module parts
Preparation of
FEE / harness
support posts
Incoming inspection of
FEE / Harness / Pigtail
Gluing of the pigtail and cooling
strap to the harness substrate
Detector stack
assembly and RSR
measurement.
Implementation of connector
saver and short circuit connector
KIP: Check of
detector stack
KIP
Cleaning of the module
and check with UV light
KIP
Final check (with UV light)
of the completed module
before shipping
Photoconductor Detector Modules
Integration of FEE / harness
substrate,
completion of electricalwiring,
fixing of FO
12
PACS IHDR
12/13 Nov 2003
Procurement of Parts for / Assembling of Flight Modules
•
Status of parts procurement for Flight Modules
- Procurement of small parts nearly finished
- Delivery of FM FEEs starts end of November 2003
- Delivery of the pigtail from Cannon beginning of December 2003
- Procurement of FOs scheduled for December 2003
problem: Au coating not yet acceptable, solution mid November
- Procurement of module bodies initiated (delay about 2 month)
• Stack assembly of Flight Modules could starts around mid November
if the pixel selection rule is confirmed by MPE
• First sixpack not before end of January 2004
• Funding of Flight modules assured only until the end of 2. sixpack
(end of February 2004)
Time critical: Procurement / Assembly of Modules
Photoconductor Detector Modules
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Summary
• Interfaces to MPE housing, KT board and IMEC FEE
and harness substrate defined
• Module design finished (specifications fulfilled)
but: Pending problem of Contact resistance (?)
between stainless steel wire and H20E glue
• Manufacturing of Flight Modules Initiated
but: Pixel selection rule to be confirmed
Photoconductor Detector Modules
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