
FNC42060F / FNC42060F2 Motion SPM 45 Series FNC42060F
... SPM® 45 module providing a fully-featured, high-performance inverter output stage for AC Induction, BLDC, and PMSM motors. These modules integrate optimized gate drive of the built-in IGBTs to minimize EMI and losses, while also providing multiple on-module protection features including under-voltag ...
... SPM® 45 module providing a fully-featured, high-performance inverter output stage for AC Induction, BLDC, and PMSM motors. These modules integrate optimized gate drive of the built-in IGBTs to minimize EMI and losses, while also providing multiple on-module protection features including under-voltag ...
Design of an Audio Amplifier
... An amplifier is an electronic device that amplifies the voltage, current or power of a signal. Amplifiers are classified in two main ways: The first classification is by function and other is by frequency response [1]. The functional op-amps are voltage amplifiers and power amplifiers. In these op-a ...
... An amplifier is an electronic device that amplifies the voltage, current or power of a signal. Amplifiers are classified in two main ways: The first classification is by function and other is by frequency response [1]. The functional op-amps are voltage amplifiers and power amplifiers. In these op-a ...
OPA1632 数据资料 dataSheet 下载
... the VOCM pin from a low-impedance source can be used to directly set the output common-mode voltage. For a VOCM voltage at mid-supply, make no connection to the VOCM pin. Depending on the intended application, a decoupling capacitor is recommended on the VOCM node to filter any high-frequency noise ...
... the VOCM pin from a low-impedance source can be used to directly set the output common-mode voltage. For a VOCM voltage at mid-supply, make no connection to the VOCM pin. Depending on the intended application, a decoupling capacitor is recommended on the VOCM node to filter any high-frequency noise ...
SD3272-32X4-81VRS4
... 400mil package and a 2K EEPROM in 8-pin TSSOP package on a 168-pin glass-epoxy substrate. Two 0.1uF (or 0.22uF) decoupling capacitors are mounted on the printed circuit board in parallel for each SDRAM. The SD3272-32X4-81VRS4 is a Dual In-line Memory Module and is intended for mounting into 168-pin ...
... 400mil package and a 2K EEPROM in 8-pin TSSOP package on a 168-pin glass-epoxy substrate. Two 0.1uF (or 0.22uF) decoupling capacitors are mounted on the printed circuit board in parallel for each SDRAM. The SD3272-32X4-81VRS4 is a Dual In-line Memory Module and is intended for mounting into 168-pin ...
BDTIC www.BDTIC.com/infineon RF and Protection Devices BCR450, TDA4863
... approach is needed, to reach the 350mA required current for the used OSRAM Golden Dragon + series LEDs for such higher power applications, the LED driver is used as a “controller” and an external “booster transistor” is employed to handle the higher current and heat dissipation. For the correct choi ...
... approach is needed, to reach the 350mA required current for the used OSRAM Golden Dragon + series LEDs for such higher power applications, the LED driver is used as a “controller” and an external “booster transistor” is employed to handle the higher current and heat dissipation. For the correct choi ...
doc
... Check the voltmeter and ammeter box on the right to see those two devices. Check the “schematic” box on the right see the more familiar symbols. Procedure: A. One Resistor 1. Drag wires and parts over to create a circuit like (a). Make sure that all of your wires are connected. Arrange the singl ...
... Check the voltmeter and ammeter box on the right to see those two devices. Check the “schematic” box on the right see the more familiar symbols. Procedure: A. One Resistor 1. Drag wires and parts over to create a circuit like (a). Make sure that all of your wires are connected. Arrange the singl ...
GTS 15/25/40/50/60/75/90/120A
... • respect the installation distances between one device and another (to allow for dissipation of generated heat). • to keep air in movement, we advise you to install a fan near the GTS group in the electrical panel containing the GTSs. • respect the indicated dissipation curves Maintenance: at regul ...
... • respect the installation distances between one device and another (to allow for dissipation of generated heat). • to keep air in movement, we advise you to install a fan near the GTS group in the electrical panel containing the GTSs. • respect the indicated dissipation curves Maintenance: at regul ...
MAX774/MAX775/MAX776 -5V/-12V/-15V or Adjustable, High-Efficiency, Low I Inverting DC-to-DC Controllers
... A benefit of this control scheme is that it is highly efficient over a wide range of input/output ratios and load currents. Additionally, PFM converters do not operate with constant-frequency switching, and have relaxed stability criterion (unlike PWM converters). As a result, their external compone ...
... A benefit of this control scheme is that it is highly efficient over a wide range of input/output ratios and load currents. Additionally, PFM converters do not operate with constant-frequency switching, and have relaxed stability criterion (unlike PWM converters). As a result, their external compone ...
RF5225 2.4GHz TO 2.5GHz, 802.11B/G/N WiFi FRONT END MODULE Features
... Theory of Operation The RF5225 FEM is a single-chip integrated front-end module (FEM) for high performance WiFi applications in the 2.4GHz to 2.5GHz ISM band. The FEM addresses the need for aggressive size reduction for a typical 802.11b/g RF front-end design and greatly reduces the number of compon ...
... Theory of Operation The RF5225 FEM is a single-chip integrated front-end module (FEM) for high performance WiFi applications in the 2.4GHz to 2.5GHz ISM band. The FEM addresses the need for aggressive size reduction for a typical 802.11b/g RF front-end design and greatly reduces the number of compon ...
AB18 RC-COUPLED AMPLIFIER Analog Lab - Hik
... THEORY Single amplifier circuits, such as a common emitter, common base and common collector amplifiers are seldom found alone, as a single stage amplifier, in any system. Generally, at least two or more than two stages are connected in cascade combination. If the output of one amplifier is connecte ...
... THEORY Single amplifier circuits, such as a common emitter, common base and common collector amplifiers are seldom found alone, as a single stage amplifier, in any system. Generally, at least two or more than two stages are connected in cascade combination. If the output of one amplifier is connecte ...
Transistor–transistor logic

Transistor–transistor logic (TTL) is a class of digital circuits built from bipolar junction transistors (BJT) and resistors. It is called transistor–transistor logic because both the logic gating function (e.g., AND) and the amplifying function are performed by transistors (contrast with RTL and DTL).TTL is notable for being a widespread integrated circuit (IC) family used in many applications such as computers, industrial controls, test equipment and instrumentation, consumer electronics, synthesizers, etc. The designation TTL is sometimes used to mean TTL-compatible logic levels, even when not associated directly with TTL integrated circuits, for example as a label on the inputs and outputs of electronic instruments.After their introduction in integrated circuit form in 1963 by Sylvania, TTL integrated circuits were manufactured by several semiconductor companies, with the 7400 series (also called 74xx) by Texas Instruments becoming particularly popular. TTL manufacturers offered a wide range of logic gate, flip-flops, counters, and other circuits. Several variations from the original bipolar TTL concept were developed, giving circuits with higher speed or lower power dissipation to allow optimization of a design. TTL circuits simplified design of systems compared to earlier logic families, offering superior speed to resistor–transistor logic (RTL) and easier design layout than emitter-coupled logic (ECL). The design of the input and outputs of TTL gates allowed many elements to be interconnected.TTL became the foundation of computers and other digital electronics. Even after much larger scale integrated circuits made multiple-circuit-board processors obsolete, TTL devices still found extensive use as the ""glue"" logic interfacing more densely integrated components. TTL devices were originally made in ceramic and plastic dual-in-line (DIP) packages, and flat-pack form. TTL chips are now also made in surface-mount packages. Successors to the original bipolar TTL logic often are interchangeable in function with the original circuits, but with improved speed or lower power dissipation.