
File - BZ eLAB
... and Zener diode. Due to heavy doping depletion region becomes thin and there are enough charge carriers (majority and minority) in P & N region, that’s why less voltage is required by Zener diode to operate in reverse breakdown region. When Zener diode reaches Zener break down voltage “Vz”, its volt ...
... and Zener diode. Due to heavy doping depletion region becomes thin and there are enough charge carriers (majority and minority) in P & N region, that’s why less voltage is required by Zener diode to operate in reverse breakdown region. When Zener diode reaches Zener break down voltage “Vz”, its volt ...
BDTIC www.BDTIC.com/infineon TLE4966-3K
... applications which use a rotating pole wheel. Precise magnetic switching points and high temperature stability are achieved by active compensation circuits and chopper techniques on chip. The sensor provides a speed output at Q2 with the status (high or low) corresponding to the magnetic field value ...
... applications which use a rotating pole wheel. Precise magnetic switching points and high temperature stability are achieved by active compensation circuits and chopper techniques on chip. The sensor provides a speed output at Q2 with the status (high or low) corresponding to the magnetic field value ...
MAX15090/MAX15090A 2.7V to 18V, 12A, Hot-Swap Solution with Current Report Output General Description
... Note 3: 40.2kω is the maximum allowed external resistance value to be connected at CB pin to GND for safe operation. All devices are tested with10kω, the parameter specified at RCB = 40.2kω is guaranteed by bench characterization and correlation, with respect to the tested parameter at RCB = 10kω. ...
... Note 3: 40.2kω is the maximum allowed external resistance value to be connected at CB pin to GND for safe operation. All devices are tested with10kω, the parameter specified at RCB = 40.2kω is guaranteed by bench characterization and correlation, with respect to the tested parameter at RCB = 10kω. ...
AP Physics C 5th 6 Wks Take Home AP Exam Questions 1991
... 3. [1996E2]. Capacitors 1 and 2, of capacitance C1 = 4F and C2 = 12F, respectively, are connected in a circuit as shown above with a resistor of resistance R = 100 and two switches. Capacitor 1 is initially charged to a voltage Vo = 50 V, and capacitor 2 is initially uncharged. Both of the switch ...
... 3. [1996E2]. Capacitors 1 and 2, of capacitance C1 = 4F and C2 = 12F, respectively, are connected in a circuit as shown above with a resistor of resistance R = 100 and two switches. Capacitor 1 is initially charged to a voltage Vo = 50 V, and capacitor 2 is initially uncharged. Both of the switch ...
SP3222
... In most circumstances, decoupling the power supply can be achieved adequately using a 0.1µF bypass capacitor at C5 (refer to Figures 6 and 7). In applications that are sensitive to power-supply noise, decouple VCC to ground with a capacitor of the same value as charge-pump capacitor C1. Physically c ...
... In most circumstances, decoupling the power supply can be achieved adequately using a 0.1µF bypass capacitor at C5 (refer to Figures 6 and 7). In applications that are sensitive to power-supply noise, decouple VCC to ground with a capacitor of the same value as charge-pump capacitor C1. Physically c ...
LT1302 - Micropower High Output Current Step
... the oscillator is enabled. Switch Q4 alternately turns on, causing current buildup in inductor L1, then turns off, allowing the built-up current to flow into output capacitor C3 via D1. As the output voltage increases, so does the FB voltage; when it exceeds the reference plus ...
... the oscillator is enabled. Switch Q4 alternately turns on, causing current buildup in inductor L1, then turns off, allowing the built-up current to flow into output capacitor C3 via D1. As the output voltage increases, so does the FB voltage; when it exceeds the reference plus ...
AIC1533
... VREF, Q7 turns off and Cp starts being charged from 5µA current source (referring to BLOCK DIAGRAM). The charging time of CP, defined as T2, can be calculated as ...
... VREF, Q7 turns off and Cp starts being charged from 5µA current source (referring to BLOCK DIAGRAM). The charging time of CP, defined as T2, can be calculated as ...
MAX1182 Dual 10-Bit, 65Msps, 3V, Low-Power ADC General Description
... The MAX1182 is a 3V, dual 10-bit analog-to-digital converter (ADC) featuring fully-differential wideband trackand-hold (T/H) inputs, driving two pipelined, 9-stage ADCs. The MAX1182 is optimized for low-power, highdynamic performance applications in imaging, instrumentation and digital communication ...
... The MAX1182 is a 3V, dual 10-bit analog-to-digital converter (ADC) featuring fully-differential wideband trackand-hold (T/H) inputs, driving two pipelined, 9-stage ADCs. The MAX1182 is optimized for low-power, highdynamic performance applications in imaging, instrumentation and digital communication ...
ISO122 Precision Lowest Cost Isolation Amplifier (Rev. A)
... The ISO122 amplifier transmits the signal across the isolation barrier by a 500kHz duty cycle modulation technique. For input signals having frequencies below 250 kHz, this system works like any linear amplifier. But for frequencies above 250 kHz, the behavior is similar to that of a sampling amplif ...
... The ISO122 amplifier transmits the signal across the isolation barrier by a 500kHz duty cycle modulation technique. For input signals having frequencies below 250 kHz, this system works like any linear amplifier. But for frequencies above 250 kHz, the behavior is similar to that of a sampling amplif ...
ISO122 - Texas Instruments
... The ISO122 amplifier transmits the signal across the isolation barrier by a 500kHz duty cycle modulation technique. For input signals having frequencies below 250 kHz, this system works like any linear amplifier. But for frequencies above 250 kHz, the behavior is similar to that of a sampling amplif ...
... The ISO122 amplifier transmits the signal across the isolation barrier by a 500kHz duty cycle modulation technique. For input signals having frequencies below 250 kHz, this system works like any linear amplifier. But for frequencies above 250 kHz, the behavior is similar to that of a sampling amplif ...
VACUUM-TUBE BRIDGE
... In order that all three voltages shall be in phase and that the ratio ef e 1 shall be accurately determinable, the transformers employed are identical with the exception of the capacitance-balancing winding, which draws negligible current. The respective primary circuits are designed so that both tr ...
... In order that all three voltages shall be in phase and that the ratio ef e 1 shall be accurately determinable, the transformers employed are identical with the exception of the capacitance-balancing winding, which draws negligible current. The respective primary circuits are designed so that both tr ...
The Do`s and Don`ts of Using MOS-Gated Transistors
... The first approach to this problem is to minimize stray circuit inductance, by means of careful attention to circuit layout, to the point that whatever residual inductance is left in the circuit can be tolerated. HEXFET®s have an inductive energy rating that makes capable of withstanding these induc ...
... The first approach to this problem is to minimize stray circuit inductance, by means of careful attention to circuit layout, to the point that whatever residual inductance is left in the circuit can be tolerated. HEXFET®s have an inductive energy rating that makes capable of withstanding these induc ...
FEATURES PIN ASSIGNMENT
... is first applied by the user. This parameter is assured by component selection, process control, and design. It is not measured directly during production testing. 10. Each DS1245 has a built-in switch that disconnects the lithium source until VCC is first applied by the user. The expected tDR is de ...
... is first applied by the user. This parameter is assured by component selection, process control, and design. It is not measured directly during production testing. 10. Each DS1245 has a built-in switch that disconnects the lithium source until VCC is first applied by the user. The expected tDR is de ...
RM03D-2 A Bias Digital Predistortion
... efficiency are the most critical parameters in WCDMA PA design. The design specifications for WCDMA PAS are listed in Table I. Average power efficiency is the key factor determining the talk time and battery life for portable wireless applications [3]. To improve the average power efficiency of PAS, ...
... efficiency are the most critical parameters in WCDMA PA design. The design specifications for WCDMA PAS are listed in Table I. Average power efficiency is the key factor determining the talk time and battery life for portable wireless applications [3]. To improve the average power efficiency of PAS, ...
Transistor–transistor logic

Transistor–transistor logic (TTL) is a class of digital circuits built from bipolar junction transistors (BJT) and resistors. It is called transistor–transistor logic because both the logic gating function (e.g., AND) and the amplifying function are performed by transistors (contrast with RTL and DTL).TTL is notable for being a widespread integrated circuit (IC) family used in many applications such as computers, industrial controls, test equipment and instrumentation, consumer electronics, synthesizers, etc. The designation TTL is sometimes used to mean TTL-compatible logic levels, even when not associated directly with TTL integrated circuits, for example as a label on the inputs and outputs of electronic instruments.After their introduction in integrated circuit form in 1963 by Sylvania, TTL integrated circuits were manufactured by several semiconductor companies, with the 7400 series (also called 74xx) by Texas Instruments becoming particularly popular. TTL manufacturers offered a wide range of logic gate, flip-flops, counters, and other circuits. Several variations from the original bipolar TTL concept were developed, giving circuits with higher speed or lower power dissipation to allow optimization of a design. TTL circuits simplified design of systems compared to earlier logic families, offering superior speed to resistor–transistor logic (RTL) and easier design layout than emitter-coupled logic (ECL). The design of the input and outputs of TTL gates allowed many elements to be interconnected.TTL became the foundation of computers and other digital electronics. Even after much larger scale integrated circuits made multiple-circuit-board processors obsolete, TTL devices still found extensive use as the ""glue"" logic interfacing more densely integrated components. TTL devices were originally made in ceramic and plastic dual-in-line (DIP) packages, and flat-pack form. TTL chips are now also made in surface-mount packages. Successors to the original bipolar TTL logic often are interchangeable in function with the original circuits, but with improved speed or lower power dissipation.