- Indian Society for Heat and Mass Transfer
... Comparative studies of results of surfactant were broadly discussed into two categories as boiling behavior and boiling curves. The boiling phenomenon mainly depends on physical properties of fluid that are density, surface tension and kinematic viscosity. The addition of a small amount of surfactan ...
... Comparative studies of results of surfactant were broadly discussed into two categories as boiling behavior and boiling curves. The boiling phenomenon mainly depends on physical properties of fluid that are density, surface tension and kinematic viscosity. The addition of a small amount of surfactan ...
Investigation on Numerical Modeling of Water Vapour Condensation
... this layer before it approaches the cooling solid surface. Moreover, the presence of even a small quantity of non-condensable gas significantly affects the heat transfer resistance in the region of the vapour-liquid interface. Experimental studies show that the non-condensable gases existence in the ...
... this layer before it approaches the cooling solid surface. Moreover, the presence of even a small quantity of non-condensable gas significantly affects the heat transfer resistance in the region of the vapour-liquid interface. Experimental studies show that the non-condensable gases existence in the ...
Outline Introduction State Functions Energy, Heat, and Work
... U – internal energy (all potential and kinetic energies). U is a state function depends only on thermodynamic state of the system (e.g. P, V, T for a simple system). q – energy added to the system as heat. Positive (+) when the system gains heat from outside (……………. process), negative (-) when heat ...
... U – internal energy (all potential and kinetic energies). U is a state function depends only on thermodynamic state of the system (e.g. P, V, T for a simple system). q – energy added to the system as heat. Positive (+) when the system gains heat from outside (……………. process), negative (-) when heat ...
CFD ANALYSIS 5.7
... be calculated by FLOTRAN. – The flow and energy equations are solved – FLOTRAN calculates surface temperature and heat flux – Heat transfer coefficients are calculated based on the surface temperatures and the Bulk Temperature ...
... be calculated by FLOTRAN. – The flow and energy equations are solved – FLOTRAN calculates surface temperature and heat flux – Heat transfer coefficients are calculated based on the surface temperatures and the Bulk Temperature ...
Apparent latent heat of evaporation from clothing: attenuation and
... rates (in Watts), can be determined directly, whereas the dry (DRY) heat loss rate (R ⫹ C ⫹ K) is normally calculated as the balance of all other heat gain and loss rates (DRY ⫽ M ⫺ W ⫺ EVAP ⫺ RESP ⫺ S). The latter is often done in clothing research and thermal tolerance studies (17, 19, 20, 31), wh ...
... rates (in Watts), can be determined directly, whereas the dry (DRY) heat loss rate (R ⫹ C ⫹ K) is normally calculated as the balance of all other heat gain and loss rates (DRY ⫽ M ⫺ W ⫺ EVAP ⫺ RESP ⫺ S). The latter is often done in clothing research and thermal tolerance studies (17, 19, 20, 31), wh ...
- Pcpolytechnic
... Chemical equilibrium: The system is said to be in chemical equilibrium when there are no chemical reactions going on within the system or there is no transfer of matter from one part of the system to other due to diffusion. Two systems are said to be in chemical equilibrium with each other when thei ...
... Chemical equilibrium: The system is said to be in chemical equilibrium when there are no chemical reactions going on within the system or there is no transfer of matter from one part of the system to other due to diffusion. Two systems are said to be in chemical equilibrium with each other when thei ...
Heat sink
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device into a coolant fluid in motion. Then-transferred heat leaves the device with the fluid in motion, therefore allowing the regulation of the device temperature at physically feasible levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the basic device is insufficient to moderate its temperature.A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal grease improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device.