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SUPAPAC Plate Heat Exchangers
SUPAPAC Plate Heat Exchangers

... Once completed the loose end plate can be pulled away for inspection or cleaning. Dismantling of the plate pack must be carried out with care in order to prevent damage to the gaskets. Each plate must be cleaned individually. Ideally the plates should be kept in the frame. If this is not possible th ...
Foal Heat Breeding
Foal Heat Breeding

Heat stress in mining
Heat stress in mining

... underground mine are humidity and air speed (Brake et al, 1998: 2). At humidity levels less than 100%, air speed over the skin improves the rate of evaporation, thus reducing the risk of heat stress. However, if the air vapour is saturated (100% humidity), evaporation ceases. Conduction, convection ...
Heat Transfer Performance of Functionalized Graphene
Heat Transfer Performance of Functionalized Graphene

Thermodynamics - WordPress.com
Thermodynamics - WordPress.com

... If a system is perfectly conducting to the surroundings and the temperature remains constant j throughout the process, it is called an isothermal process. Consider a working substance at a certain % pressure and temperature and having volume represented by the point A (Fig. 4.6). Pressure decreased ...
Thermal properties of rocks at the investigation sites
Thermal properties of rocks at the investigation sites

Performance, Reliability, and Approaches Using a Low Melt Alloy as
Performance, Reliability, and Approaches Using a Low Melt Alloy as

Final Report.doc
Final Report.doc

... materials for TE devices and recovering waste heat as a green energy source. Thermoelectric technology is used in countless applications to power small electronics, or harness enough energy from large heat producing sources to power smaller applications, such as using the waste heat from an automobi ...
Final Draft_v2.pdf
Final Draft_v2.pdf

Heat Transfer Enhancement in a Circular Tube Twisted with Swirl
Heat Transfer Enhancement in a Circular Tube Twisted with Swirl

... which vary in twist ratio and rotation angle. Space ratio also has an important effect on the characteristics. For Comparison, experiments in a smooth circular tube and a convergingdiverging (CD) tube without twisted-tapes were carried out. The results show that the twistedtape with twist ratio y=4. ...
Cooling Efficiency Study of Hydrogen Batch Annealing Process
Cooling Efficiency Study of Hydrogen Batch Annealing Process

... heat exchanger, an optimum dose, type of chemicals, calcium hardness and flow rate of cooling water were determined. The experimental results showed that 10ppm of scale inhibitor (ASC-2) and 36-40m3/hr cooling water were suitable for the indirect cooling water, which resulted in the resistance coeff ...
Temperature Field and Thermal Stress Analyses of
Temperature Field and Thermal Stress Analyses of

Three-dimensional analysis of heat transfer in a micro
Three-dimensional analysis of heat transfer in a micro

Thermal Transmittance Values for Residential Buildings
Thermal Transmittance Values for Residential Buildings

Thin-Film Thermal Conductivity Measurement Using Microelectrothermal Test Structures and Finite-Element-Model-Based Data Analysis
Thin-Film Thermal Conductivity Measurement Using Microelectrothermal Test Structures and Finite-Element-Model-Based Data Analysis

... frequency [1], [11], [14]. Another well-known method is based on steady-state joule heating with dc current excitation [9]. For thermometric methods, in which heat is made to flow through a sample and the resulting temperature changes detected, interpretation of the results is simplified if heat tra ...
Investigation of Heat Transfer Due To Isothermal Heater in
Investigation of Heat Transfer Due To Isothermal Heater in

... Equation 2 and equation 3 are the mathematical representation of heat and fluid characteristics that dictates the fluid flow and heat transfer in porous region. These are complex equations which can be solved simultaneously by converting them into alternate form that makes it easy for solution. Thes ...
Effects of Surface Tension and Binary Diffusion on Pool Boiling of
Effects of Surface Tension and Binary Diffusion on Pool Boiling of

Diapositive 1
Diapositive 1

... Assuming that the chip power is 25 µW/channel total power to dissipate will be : 2055 W  external cooling OK inside each slab : necessity of cooling system but active or passive ? Ex: Pessimist simulation of heat conduction just by the heat shield : λ = 400 W/m/K (copper) ; S = 124*0,4 mm2 L = 1,55 ...
Influence of coupled pinch point temperature difference and
Influence of coupled pinch point temperature difference and

Propagation of thermal waves with lateral heat transfer
Propagation of thermal waves with lateral heat transfer

AN1029 Maximum Power Enhancement Techniques for SO-8 Power MOSFETs 1. Introduction
AN1029 Maximum Power Enhancement Techniques for SO-8 Power MOSFETs 1. Introduction

Applied Thermodynamics
Applied Thermodynamics

... However, there are some processes that can be assumed internally reversible with good approximation, such as processes in cylinders with reciprocating piston. The working fluid is always in an equilibrium state in internally reversible process. But the surroundings undergo a state change that can ne ...
Mechanistic Modeling of CHF In Forced-Convection
Mechanistic Modeling of CHF In Forced-Convection

Chapter 20
Chapter 20

1208-TOFE-Rader-HEMJ - Advanced Energy Technology
1208-TOFE-Rader-HEMJ - Advanced Energy Technology

< 1 ... 10 11 12 13 14 15 16 17 18 ... 54 >

Heat sink



A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device into a coolant fluid in motion. Then-transferred heat leaves the device with the fluid in motion, therefore allowing the regulation of the device temperature at physically feasible levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the basic device is insufficient to moderate its temperature.A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal grease improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device.
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